[tinwhiskers] ACE Develops Lead Tinning System

  • From: "Bob Landman" <rlandman@xxxxxxxxxxxxxxxxx>
  • To: <tinwhiskers@xxxxxxxxxxxxx>
  • Date: Sat, 31 May 2008 17:16:38 -0400

How some entrepreneurs hope to make a pile of money off our collective misery 
thanks to RoHS ...  
This was just in SMT magazine.  Note this particular statement (a real gem):
"which converts components from tin/lead to lead-free, or vice versa, for 
high-reliability or RoHS-compliant products"
Bob Landman
H&L Instruments,LLC
http://smt.pennnet.com/display_article/327044/35/ARTCL/none/none/1/ACE-Develops-Lead-Tinning-System/?pc=ENL&pc=ENL
ACE Develops Lead Tinning System
(April 28, 2008) SPOKANE VALLEY, Wash. ? ACE Production Technologies Inc. 
introduced the LTS200 lead tinning system, which converts components from 
tin/lead to lead-free, or vice versa, for high-reliability or RoHS-compliant 
products.
A programmable, automated machine, the LTS200 safely reconditions component 
leads. It suits conventional lead tinning for high-reliability applications and 
reconditioning tin/lead parts for RoHS compliance. Military and aerospace 
customers are using the LTS200 in programs where it has been difficult to 
acquire high-reliability tin/lead parts, explained Al Cable, president. 
The LTS200 is an automated machine that is built using common designs and 
components from ACE's KISS selective soldering systems, including the KISS-ware 
OS. The LTS200 system has a central fluxing station with two solder pots, one 
mounted on either side of the fluxer. One solder pot is dedicated to flushing 
off the original coating or plating; the other solder pot is dedicated to the 
virgin alloy for the final coating. The pallet holder accepts a variety of 
component-specific pallets.
The system can be programmed to handle all leaded parts, including transistors, 
capacitors, diodes, axials, radials, QFPs, PGA, SIPs, dips, connectors, and 
more.
Users can create and add programmable routines such as "agitate in the solder" 
to help remove the original coating. The operator can specify and control 
"withdrawal rate" from the final solder bath to increase solder thickness.
For more information, visit www.ace-protech.com.

 

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