[tinwhiskers] Re: ACE Develops Lead Tinning System
- From: "Niki Steenkamp" <niki@xxxxxxxxxxxxxx>
- To: <tinwhiskers@xxxxxxxxxxxxx>
- Date: Wed, 4 Jun 2008 10:17:51 +0200
Hi,
I have only been following this list for a month or so, but I was wondering
if there has been any tin-whisker failure documented that can be attributed
to RoHS. All the NASA and other tin-whisker failure reports I have seen are
from the pre-RoHS era (which goes to show that even without RoHS we had
problems!). Most "modern" papers demonstrate whisker growth in lab
environments. Although all of this is relevant and should at the very least
blink red warning lights in our minds, I do not think anybody will really sit
up and take notice until things start failing AND it can be proven that it is
due to RoHS. It is sad, but that is how humans work. And with so many
Pb-free systems in the field by now, failures should start occurring. Maybe
we should focus not on waiting until the first airplane falls form the sky,
but rather look for tin-whisker related problems in everyday electronics of
which there are many more potential candidates. Build up a solid database of
verifyable RoHS failures and we will have undeniable proof. I was recently
in a SMD manufacturing seminar where a fairly well respected international
expert stated that he does not believe tin whiskers are a reality in real
life and that they occur only in labs. Scary.
Regards,
Niki Steenkamp
________________________________
From: tinwhiskers-bounce@xxxxxxxxxxxxx
[mailto:tinwhiskers-bounce@xxxxxxxxxxxxx] On Behalf Of John Lau Hon-Shing
Sent: 04 June 2008 01:35 AM
To: Engelmaier@xxxxxxx; tinwhiskers@xxxxxxxxxxxxx
Subject: [tinwhiskers] Re: ACE Develops Lead Tinning System
Dear Werner:
As I said I totally agreed with you that it is not ACE's fault/problem. When
I was at Agilent, we also did re-balling to replace the SAC balls to SnPb
balls. Even all of our products are out of the scope of EU RoHS, however, all
the DRAM (in PBGA) already concerted to lead-free and our products need more
than 20 years of lives.
By the way, I just told Michelle this morning that I cannot go to London this
time and asked her to give all my registrants to you. Please talk to her!
Thanks & Best Wishes!
John H. Lau
Microsystems, Modules & Components Laboratory
Institute of Microelectronics (IME)
11 Science Park Road
Singapore Science Park II
Singapore 117685
TEL:(65)6770-5424; lauhs@xxxxxxxxxxxxxxxxx
________________________________
From: Engelmaier@xxxxxxx [mailto:Engelmaier@xxxxxxx]
Sent: Wednesday, June 04, 2008 07:16 AM
To: John Lau Hon-Shing; tinwhiskers@xxxxxxxxxxxxx
Subject: Re: [tinwhiskers] Re: ACE Develops Lead Tinning System
Hi John,
In your world-that is mass-produced consumer products, the pragmatic view has
to be that the Pb-ban is a fact of life. And with these products it is a fact
of life.
But what do I tell a client with a 24-layer 250-mil thick PCB with 4 power-
and ground-layers who has to put BGAs on it.
They do not fall under RoHS.
They do not sell in the EU, China, Japan, Korea, etc.
What I tell them is to re-ball to Sn37 AND use vapor phase-works like a
charm.
That is why people develop these systems to re-coat, re-ball, etc., because
there is a market for it, that cannot be met with Pb-free solders [they do
not want to go the Bi- or In-route].
See you in London at NEW.
Werner
Future workshops:
Reliability Issues with Lead-Free Soldering Processes, June 17, London
Interconnect Failures and Design for Reliability for PCB PTHs, June 17,
London
Pb-Free Soldering Processes-Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture,
ENIG), September 22, Schaumburg
**************
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