[SI-LIST] Re: One stitching via or more vias is better for 25Gbps application???

  • From: Hsiuan-ju Hsu <hsiuanju@xxxxxxxxxxx>
  • To: "lee.home.61@xxxxxxxxx" <lee.home.61@xxxxxxxxx>, "bertsimonovich@xxxxxxxxxx" <bertsimonovich@xxxxxxxxxx>, Bipin Dhavale <bipinpd@xxxxxxxxx>
  • Date: Thu, 11 Sep 2014 22:57:47 +0000

Hi, Yu-yuan 
You may refer to the following patents. Let me know how you think: 
1. Via structure for improving signal integrity. US8084695 
2. Interconnection structure for improving signal integeiry. US 8153906 
Hope this help.. 
Best regards, 
Robert Hsu  

CC: weirsi@xxxxxxxxxx; leeritchey@xxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx 
From: lee.home.61@xxxxxxxxx 
Subject: [SI-LIST] Re: One stitching via or more vias is better for  
25Gbps application??? 
Date: Tue, 9 Sep 2014 07:08:30 +0800 
To: bertsimonovich@xxxxxxxxxx; bipinpd@xxxxxxxxx 
Thank you so much 
After studying document you indicated, 
1. It seems only one vias (-90dB) with symmetric configuration is  
better than multi vias (-55dB) with symmetric configuration under 10Ghz  
frequency. How about above 10Ghz frequency range? Is it the same trend? 
2. The lowest coupling with two GND layer means that it had better to  
remove pad at other GND planes. Is it true or not? Do anyone do this  
kind of simulation? 
Bipin Dhavale <bipinpd@xxxxxxxxx> 於 2014/9/8 下午11:56 寫道: 
In addition to paper you sent, below is one study with asymmetric  
differential pairs. ( most large bga breakouts wont have symmetric diff  
Its not the exact same case of transition via's but still. 
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