[SI-LIST] Re: Tools to Create IBIS Models

  • From: "Muranyi, Arpad" <arpad.muranyi@xxxxxxxxx>
  • To: <si-list@xxxxxxxxxxxxx>
  • Date: Mon, 22 Mar 2004 16:10:10 -0800

Mike,

I was watching this conversation closely.  First, since I agree
that C_comp is one of the most neglected areas in the IBIS spec.,
I would  be interested in seeing your suggested improvements on
that.  Second, I am involved with some internal activities in
which we are working towards modeling improvements to satisfy
our and our customer's modeling needs.

This is all happening now because of the new capabilities in the
IBIS 4.1 specification through the new language extensions
(VHDL-AMS and Verilog-AMS).  With these extensions most of the
limitations and rigidities of the old IBIS specification has
been removed and it is up to the model writer now to make sure
that the model is accurate enough.

We can't say any more that IBIS is not capable of this and that,
or not accurate, etc...  It is now entirely up to the model maker
to come up with a model that is accurate enough for their needs.
The question now is how do we write our models and make them
accurate enough for their purpose.  There is a lot to learn in
this respect, and I am keeping my eyes open.  I would like to
encourage any contribution in this respect in any forum, such as
these email discussion groups, IBIS summits, and the like.

Thanks,

Arpad Muranyi
Intel Corporation
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=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
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-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of MikonCons@xxxxxxx
Sent: Monday, March 22, 2004 2:20 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Tools to Create IBIS Models


In a message dated 3/21/2004 5:11:51 PM Pacific Standard Time,=20
bob@xxxxxxxxxxxxx writes:
The next IBIS Summit Meeting is on Monday, April 5 at DesignCon East.
Several people who cannot travel to DesignCon are teleconferencing
in their presentations.  This is short notice, but you are welcome
to create a 10-20 page presentation and deliver it at this meeting.
**************
Bob:
Thanks for the invite, but I have too many things on my plate at the =
moment=20
to support the DesignCon East timetable. At this point, I have not yet =
prepared=20
the associated slides for an in-person presentation, and I'm thinking of =

adding some more complex models and simulations to the paper to =
illustrate the=20
ease of inserting coupled package pins and coupled T-lines for =
end-to-end model=20
analysis.

Perhaps we can work out a meeting later this year.

Mike

Michael L. Conn
Owner/Principal Consultant
Mikon Consulting
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