[SI-LIST] Re: Tools to Create IBIS Models
- From: "Muranyi, Arpad" <arpad.muranyi@xxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Tue, 23 Mar 2004 15:22:00 -0800
Mike,
Thanks for your response. You got my curiosity up with your
statement: "The newly released IBIS specification (and how it is=20
interpreted) may or may not solve all of the known deficiencies
(once it is implemented by the IC vendors)."
Would you mind if I asked you to expand on that a little more?
What is it that makes you think "may not solve all of the known
deficiencies"?
Thanks,
Arpad
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-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of MikonCons@xxxxxxx
Sent: Tuesday, March 23, 2004 1:09 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Tools to Create IBIS Models
Arpad, I totally agree. I like to participate in any discussions that=20
increase the knowledge and expertise of contributing members to the SI =
List through=20
shared experiences, original analyses, and open discussion of the =
accompanying=20
rationale. Just to assure clarification, I appreciate and acknowledge =
the many=20
efforts and contributions of the people who have created and continually =
refine the IBIS movement.
My activity that led to the development of a unique IBIS-to-SPICE =
conversion=20
technique was born of necessity over three years ago, when the depth and =
quality of available IBIS models was inadequate for my purposes. My =
clients could=20
not wait for new updates to the IBIS specification and the subsequent =
delays=20
for vendor implementation of same. Nor did the semiconductor vendors =
make it any=20
easier to obtain timely NDAs for (generally encrypted) H-SPICE files. (I =
do=20
not use H-SPICE unless furnished in-house by a client.) I refined the=20
conversion technique and successfully completed analyses and new design =
tasks to=20
support my client's schedules. In the process, I was able to detect =
errors and=20
inconsistencies in published IBIS models, as well as partition and alter =
the model=20
structure to yield more flexibility in building end-to-end signal paths. =
After=20
working with a few IC vendors, I further refined the structure to yield=20
variable capacitive loading associated with the clamping structures of =
the devices=20
to achieve better model predictions for the ever higher switching slew =
rates=20
of new devices. The newly released IBIS specification (and how it is=20
interpreted) may or may not solve all of the known deficiencies (once it =
is implemented=20
by the IC vendors). Yet, I am sure it is a step in the right direction =
for=20
improved modeling flexibility and accuracy.
As time goes by, hopefully the IBIS model structure will surpass my=20
individual techniques. With my current activities, it may well be this =
fall before I=20
have a complete presentation to go along with an updated paper I have =
now=20
planned.=20
Respectfully,
Mike
Michael L. Conn
Owner/Principal Consultant
Mikon Consulting
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