(no subject)
- From: tayyab@xxxxxxxxxxxxxx
- To: undisclosed-recipients:;
- Date: Tue, 27 Jan 2004 23:19:26 -0500 (EST)
a id <DM1JB073>; Wed, 28 Jan 2004 09:25:15 +0500
Message-ID: <4DAA764A109C4340927A33CD01982861108593@xxxxxxxxxxxx>
From: Tayyab Jamil <tayyab@xxxxxxxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Subject: Distribution/Filtering/Decoupling Guide, 0.8mm BGA, to be used or
not?
Date: Wed, 28 Jan 2004 09:25:06 +0500
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Hello,
I am required to layout a board with a 0.8 mm pin pitch 532 pin package of a
DSP, signal rise time is 2 ns.
So I am much more interested in knowing if thre is any thing regarding the
problems, suggestions, advice or any body's personal experience using such a
small and high pin count package.
Regards
Tayyab
-----Original Message-----
From: Steven M. Waldstein [mailto:swldstn@xxxxxxxxxxxx]
Sent: Saturday, January 17, 2004 8:48 AM
To: scott@xxxxxxxxxxxxx; Chris.Cheng@xxxxxxxxxxxx
Cc: 'steve weir'; epriest@xxxxxxxxxxxxxxxxxxx; silist
Subject: [SI-LIST] Re: [SI-LIST]: Distribution/Filtering/Decoupling Gu
ide The 100Mhz clean cut off.
To all,
Does anyone have a reference to a paper that compares the issues
of 1.27mm vs 1.0mm BGA pitch from the point of view of electrical
performance? I've been fighting a losing battle over this because
the 1mm packages are cheaper ( due to the substrate size ).
Does anyone have any analysis they are willing to share or a
a description of simulations and tools necessary to create results
that show the problems with 1mm and soon 0.8mm packages?
Any ammunition in this battle is helpfull.
Steve
swldstn@xxxxxxxxxxxx
-
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<TITLE>Distribution/Filtering/Decoupling Guide, 0.8mm BGA, to be used =
or not?</TITLE>
</HEAD>
<BODY>
<BR>
<P><FONT SIZE=3D2>Hello,</FONT>
</P>
<P><FONT SIZE=3D2>I am required to layout a board with a 0.8 mm pin =
pitch 532 pin package of a DSP, signal rise time is 2 ns.</FONT>
</P>
<P><FONT SIZE=3D2>So I am much more interested in knowing if thre is =
any thing regarding the problems, suggestions, advice or any body's =
personal experience using such a small and high pin count =
package.</FONT></P>
<P><FONT SIZE=3D2>Regards</FONT>
<BR><FONT SIZE=3D2>Tayyab</FONT>
<BR><FONT SIZE=3D2> </FONT>
</P>
<P><FONT SIZE=3D2>-----Original Message-----</FONT>
<BR><FONT SIZE=3D2>From: Steven M. Waldstein [<A =
HREF=3D"mailto:swldstn@xxxxxxxxxxxx";>mailto:swldstn@xxxxxxxxxxxx</A>]</F=
ONT>
<BR><FONT SIZE=3D2>Sent: Saturday, January 17, 2004 8:48 AM</FONT>
<BR><FONT SIZE=3D2>To: scott@xxxxxxxxxxxxx; =
Chris.Cheng@xxxxxxxxxxxx</FONT>
<BR><FONT SIZE=3D2>Cc: 'steve weir'; epriest@xxxxxxxxxxxxxxxxxxx; =
silist</FONT>
<BR><FONT SIZE=3D2>Subject: [SI-LIST] Re: [SI-LIST]: =
Distribution/Filtering/Decoupling Gu</FONT>
<BR><FONT SIZE=3D2>ide The 100Mhz clean cut off.</FONT>
</P>
<BR>
<P><FONT SIZE=3D2>To all,</FONT>
</P>
<P><FONT SIZE=3D2>Does anyone have a reference to a paper that compares =
the issues</FONT>
<BR><FONT SIZE=3D2>of 1.27mm vs 1.0mm BGA pitch from the point of view =
of electrical</FONT>
<BR><FONT SIZE=3D2>performance? I've been fighting a losing battle over =
this because</FONT>
<BR><FONT SIZE=3D2>the 1mm packages are cheaper ( due to the substrate =
size ).</FONT>
</P>
<P><FONT SIZE=3D2>Does anyone have any analysis they are willing to =
share or a</FONT>
<BR><FONT SIZE=3D2>a description of simulations and tools necessary to =
create results</FONT>
<BR><FONT SIZE=3D2>that show the problems with 1mm and soon 0.8mm =
packages?</FONT>
</P>
<P><FONT SIZE=3D2>Any ammunition in this battle is helpfull.</FONT>
</P>
<P><FONT SIZE=3D2>Steve</FONT>
<BR><FONT SIZE=3D2>swldstn@xxxxxxxxxxxx</FONT>
</P>
<P><FONT SIZE=3D2>-</FONT>
<BR><FONT SIZE=3D2> </FONT>
</P>
</BODY>
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