[tinwhiskers] Re: Exemption on high temperature lead solder
- From: "Parnagian, Ed" <ed.parnagian@xxxxxxxxxxx>
- To: "tinwhiskers@xxxxxxxxxxxxx" <tinwhiskers@xxxxxxxxxxxxx>
- Date: Wed, 27 Aug 2008 22:09:43 +0200
Hi, Werner!
I guess I was expecting you to hit me with some characteristic that was unique
to high lead content solder. I've had no experience with high lead solders so
was hoping to learn if they had any peculiarities.
Thanks for keeping it simple!
Ed
From: tinwhiskers-bounce@xxxxxxxxxxxxx
[mailto:tinwhiskers-bounce@xxxxxxxxxxxxx] On Behalf Of Engelmaier@xxxxxxx
Sent: 2008 Aug 27 3:31 PM
To: Parnagian, Ed; tinwhiskers@xxxxxxxxxxxxx
Subject: [tinwhiskers] Re: Exemption on high temperature lead solder
Hi Ed,
To your question as to what characteristic(s) of the high lead-content solder
makes it vulnerable to the transition from eutectic SnPb to SAC305, here are
some examples:
1) SAC is stiffer (higher modulus)--results in higher stresses;
2) SAC creeps slower--results in higher stresses;
3) SAC is stronger--results in higher stresses.
Werner
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