Hi All, I have a basic question related to on-chip PDN design. Usually the supply voltages are designed to be isolated for core, SERDES digital, analog, termination, etc. This design may isolate the SSN couplings among each net. However, usually large on-chip decoupling capacitances are used for VDD core circuit. In the board design, we connect the power nets of VDD_core together with VDD_digital¡£ Thus, switching noises generated from SERDES digital are suppressed by large on-chip decaps designed for core circuit. However, package inductances still play a bad role here to block the conducted path between noise source formed by digital circuit and core capacitances. Then why not use one common power net as the supply power for all the IC circuits, so that large on-chip decaps can be shared, if the voltage levels are the same? Regards, Siming Pan -- Siming Pan ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu