[SI-LIST] Re: design of on-chip PDN

  • From: steve weir <weirsi@xxxxxxxxxx>
  • To: Siming Pan <pansiming86@xxxxxxxxx>
  • Date: Mon, 01 Nov 2010 18:36:56 -0700

Siming, please read the replies already provided as they have explained 
this.  Better yet, buy a copy of Cosmin's book.

Steve.
Siming Pan wrote:
> Hi All,
>     Thanks very much for your reply.
>     For the ASIC I am currently deal with, the voltage level for digital
> serdes and core are the same. So the reduction of common impedance seems to
> be the main reason that power nets for serdes and core are not connected.
> However, since the on-chip decaps for core is 100 times larger than it for
> digital serdes, common power net will significantly reduce SSN. How much
> impact for common impedance will the connection of power net cause?
>
> Regards,
> Siming
>
>
> 2010/11/1 Chris Cheng <Chris.Cheng@xxxxxxxx>
>
>   
>> I've never dealt with an ASIC chip that doesn't have at least dual oxide to
>> separate core and I/O power distribution. Unless you are in the low power
>> business, there are many reasons why you want your I/O power higher than
>> your core voltage with all the new small geometry processes.
>> While common mode noise can be a concern, people have done tricks like on
>> die regulators and play with PLL loop bandwidth to mitigate these problems.
>>
>> Chris Cheng
>> Distinguished Technologist
>> 3PAR- an HP Company
>> HP StorageWorks Division
>>
>> www.hp.com
>> www.3PAR.com
>>
>> PS Go Giants !!!!!!!
>>
>> -----Original Message-----
>> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
>> On Behalf Of Siming Pan
>> Sent: Monday, November 01, 2010 4:10 PM
>> To: si-list@xxxxxxxxxxxxx
>> Subject: [SI-LIST] design of on-chip PDN
>>
>> Hi All,
>>   I have a basic question related to on-chip PDN design. Usually the supply
>> voltages are designed to be isolated for core, SERDES
>>
>>  digital, analog, termination, etc. This design may isolate the SSN
>> couplings among each net. However, usually large on-chip decoupling
>>
>>  capacitances are used for VDD core circuit. In the board design, we
>> connect
>> the power nets of VDD_core together with VDD_digital¡£
>>
>> Thus, switching noises generated from SERDES digital are suppressed by
>> large
>> on-chip decaps designed for core circuit. However,
>>
>> package inductances  still play a bad role here to block the conducted path
>> between noise source formed by digital circuit and core
>>
>> capacitances. Then why not use one common power net as the supply power for
>> all the IC circuits, so that large on-chip decaps can be
>>
>> shared, if the voltage levels are the same?
>>
>> Regards,
>>
>> Siming Pan
>>
>>
>> --
>> Siming Pan
>>
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>>     
>
>
>   


-- 
Steve Weir
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