Chrsi no problem, we'll take care of that noise with single points and splits! Seriously, if you would like to do a test vehicle out of academic interest, I think you will find that DET does a better job suppressing EMI than a highly reflective fence. Regards, Steve At 10:48 AM 12/6/2004 -0800, Chris Cheng wrote: >The reality will be the top/bottom layers will have microstrip signals added >(8 layers) which will force me to use ground plane reference and arrangement >like 6) with outer signal layers added will unlikely to happen in my design. >If you have microstrip signals and construct it with power as reference >plane at the bottom as in 6). You are in for more trouble than edge >radiation. > >-----Original Message----- >From: steve weir >To: Chris Cheng; Chris Cheng; ''sguzek@xxxxxxxxx ' '; ''Si-List ' ' >Sent: 12/6/2004 10:38 AM >Subject: RE: [SI-LIST] Re: Why is capacitor with high ESR > >Chris, I agree that 7 will work better than 5, although it might be a >little bit less representative of what people actually build. > >Where we disagree is whether 7 will actually be better than 6. I don't >think it will for the reasons stated. Do you think you can convince >your >company to build two test boards, one as 7 and one as 6? The >alternative >is to run models, assuming we want to trust them. > >Regards, > > >Steve > > >At 10:12 AM 12/6/2004 -0800, Chris Cheng wrote: > >Steve, > >I would think > > > >7) > >Gnd > >Power > >Signal > >Signal > >Gnd > >Gnd > > > >with the fence and sea of vias and decoupling in between will be better >than > >6) > > > >For 4) it is obvious there is no edge containment. > >For 5) while the edge containment can help the first five layers, the >bottom > >power plane can still have noise current which solely relie on >decoupling > >caps that may or may not be effective and you will need a case like 6) >to > >ensure the complete edge containment (since you can short the gnd/power > >planes with vias). > > > >-----Original Message----- > >From: steve weir > >To: Chris Cheng; 'sguzek@xxxxxxxxx '; 'Si-List ' > >Sent: 12/5/2004 11:30 PM > >Subject: RE: [SI-LIST] Re: Why is capacitor with high ESR > > > >Chris, > > > >No, I don't see a lot of value from the very low R's in existing > >caps. Yes, lots of ground vias do divide the cavities up and cause a > >lot > >of scattering. Unfortunately, even a good number of those vias rise to > >the > >surface to meet decoupling caps which then become a source of > >radiation. This is not to mention the other signal vias that do the > >same > >thing. > > > >We could have some fun constructing some ML boards with a stackup >having > >at > >least two ground planes one close to each end of the stack-up that > >allows > >for a fence. We could add more layers, but I think the following 6 > >layer > >is adequate for the thought-problem / experiment: > > > >Gnd > >Power > >Signal > >Signal > >Gnd > >Power > > > >1. Oscillator with nice fast CMOS drivers in the middle as our noise > >source, aside from local decoupling in the middle of the board, it will > >be > >an open cavity. > >2. Same as 1. but with ground fence only at the board edges. > >3. Same as 1. but with fence using DET with the best dissipative caps > >that > >we can get. > >4. Same as 1, but with lots of ground and power vias distributed > >around > >the board many connecting to decoupling caps on the surface. > >5. Save as 4, but with fence as in 2. > >6. Same as 4, but with DET as in 3. > > > >I believe that we agree that between 1, 2, and 3, that 3 will have the > >lowest radiation. > >I believe that we agree that between 1 and 4, 2 and 5, and 3 and 6, > >4/5/6 > >will have lower radiation than 1/2/3 respectively. > > > >What I think you will find interesting is that of 4, 5, and 6, that 6 > >offers considerable improvement over both 4 and 5. This has been the > >subject of much of Istvan's work on the benefits of DET. The impinging > >energy only hits the vias once on its way out to the board edge where >it > >is > >absorbed. The "ice-cube trays" of 4. help to remove a lot of the > >coherency > >from the noise, but we are pretty much stuck with the dielectric losses > >to > >dump the HF energy into heat. What does not become heat escapes on its > >way > >to Zontar. > > > >I hope that we can agree that an alternative demonstration is to break > >up > >the Vcc plane into sections that are tied together with lossy >decoupling > > > >networks. Would you be surprised to find that the EMC performance of > >such > >a board with a thick cavity is much better than the same geometry board > >where the Vcc has not been divided, sic 1, or 4 from above? > > > >Regards, > > > > > >Steve. > > > > > >At 10:41 PM 12/5/2004 -0800, Chris Cheng wrote: ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu