Dear all This morning, I spend half one hour to review all the mail about this topic. According to my experience, there is the following views: 1.Dency via will not absorb or scatter the EM energy. We have made testing PCB to study this problem. When there is no decoupling caps, the dency via will affect the resonance. While there is decoupling caps on the PCB, the effect of dency via could be ignored. In DesignCon 2004, we have proposed one paper. 2.Via along the edge of PCB will not help to eliminate the far field EMI. The via has no effect on reflecting EM energy unless the power and ground plane is connected by via. The voltage source will be shorted. We have made testing PCB to study this problem. 3.Steve and Chris have proposed seven cases about the PCB decoupling. We have measured almost the seven cases. The result is that the caps with high ESR help on eliminate power ground noise. 4.I have done some simulation about SI+PI. I do not see any great difference when the signal referenced to power or ground. There is a little difference because of the displacement current. I think power and ground are same but the voltage potential. Best Regards Zhangkun 2004.12.8 ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu