While there may be a lot of truth in the writing of Stefan below, I wonder whether what he writes is the main or only reason. Think about it this way: The package acts as a bottle neck. You need to push a lot of current through it and do it so that it can have large sudden changes. No matter how much a mother board maker is willing to spend on their design, there is a limit for how much current can be forced through the bottle neck. Beyond a certain point, no matter what you do on the mother board, you will simply not be able to push more current trough a low cost package. So my gut feeling is that Intel may not just do this to be nice to the mother board makers, and thereby win more customers for our CPUs... Arpad -------------------------------------------------------------- -----Original Message----- From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] = On Behalf Of steve weir Sent: Tuesday, May 17, 2005 9:38 AM To: Stefan Ludwig Cc: Ken Cantrell; Larry.Smith@xxxxxxx; joepaul@xxxxxxxxxxx; = si-list@xxxxxxxxxxxxx Subject: [SI-LIST] Re: Decoupling capacitors Stefan exactly! The oppressively competitive computer market has forced = Intel to design for total system cost. It's a lesson that many other = chip=20 builders need to learn well if they expect to succeed in a market that = is=20 becoming more consumer electronic, sic low total cost, oriented. Regards, Steve. At 06:27 PM 5/17/2005 +0200, Stefan Ludwig wrote: >A slightly different angle on this is the following: > >Intel's 90nm processors consume 130W these days (desktop and server=20 >parts). That can be more than 100 Amps! You simply can't afford a = "cheap",=20 >"un-bypassed" package with this sort of power and current requirements. = >Once you bypass to the max on the die itself and in the package, you = end=20 >up with a lot less stringent requirements on the PCB. > >A nice side effect of the above and a requirement from Intel's = customers=20 >is that their processors need to run with the cheapest possible boards=20 >produced by the customers' contract manufacturers. Intel must engineer = a=20 >rock solid chip/package solution, which then allows their customers to=20 >have a simpler board structure and cheaper bypassing. For a while, = Intel=20 >delivered their processors in the form of cartridges, so that even the=20 >least capable customer can build a PC board that still works. It had = the=20 >processor die and cache SRAMs on it, as well as lots of bypass caps. > >Nowadays, they sell you boxed chips, with the heat sink and cooling = fan,=20 >so you don't blow up "your precious!" > >Stefan > >"May you live in interesting times!" - Chinese curse (<- NOT, as it = turns=20 >out if you google for it.) ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu