[SI-LIST] Re: Return current of a trace in stripline

  • From: "Mustafa Yousuf" <yousufs432@xxxxxxxxx>
  • To: "'Loyer, Jeff'" <jeff.loyer@xxxxxxxxx>
  • Date: Mon, 5 Aug 2013 13:10:53 -0700

Hello Jeff,
 

Thanks for sharing you experience on this topic. I am not sure if we have
ever personally met,  but I know you from your good work via your
presentations and emails inside and outside Intel. 

 

Part of our experience on this matter was from a detailed study we did at
Intel to debug an actual SV board that failed the stress memory testing.
This was published in DTTC and DesignCon:

 

1.     Mustafa Yousuf,  Brahim Bensalem, Naveid Rahmatullah, John Mcandrew,
Srinivasan Rajagopalan., "Method to analyze cross talk between signals
routed over split reference planes" August 3, 2008. Presented at DTTC, Intel
Annual Conference, Intel Corporation. Internal Publication.

2.     Mustafa Yousuf,  Brahim Bensalem, Naveid Rahmatullah, John Mcandrew,
Srinivasan Rajagopalan, "Analysis of cross talk between signals routed over
discontinuous reference plane", Presented at DesignCon2009, February 2009.

 

I like to note that we tried to capture the s-parameter model of the DDR
site on our board using variable structure sizes on the board (different
areas, different # of layers etc). Since the return current could stray out
reaching to the closest return path to complete the least inductance loop,
we were unable to observe the full strong effect until we included the
entire DDR area with all layers included. This way the actual return path
was captured and included in the s-parameter model. This (I mean modeling
the entire structure surrounding the signal under study) is a key point that
must be kept in mind since the signal under study is expected to  interact
with the entire structure.

Thanks,

Mustafa

 

From: Loyer, Jeff [mailto:jeff.loyer@xxxxxxxxx] 
Sent: Monday, August 05, 2013 8:03 AM
To: yousufs432@xxxxxxxxx
Cc: bala89si@xxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: RE: [SI-LIST] Re: Return current of a trace in stripline

 

Hello Mustafa,

Can you share the details of your DDR failure?  I would like to know the
specifics, since I have grown to have a different opinion on this issue,
based on my experience and studies.

 

From my experience and studies, I would expect Bala's primary concerns to
be:

1)      Noise from the power plane coupling onto the trace.  If the power
plane is quiet and only 1V, there might not be any detrimental effect.  A
noisy 12V plane, however, can induce a tremendous amount of noise on the
signals.

2)      Is there sufficient coupling between the various planes at
transitions?  In my experience, this is usually not a problem.  For
realistic designs (clear back to Front Side Bus days), I haven't been able
to observe the impact of changing reference planes.  When there are
reasonably thin dielectrics, several planes, and the split between planes is
narrow (5-10 mils), the transition between planes of differing potentials
can't be observed with TDR.  But, this is for server designs - perhaps a
thick, low layer count board would behave differently.

3)      As I've said before, when crossing reasonably sized splits in
planes, I don't believe there's an issue with impedance discontinuities,
crosstalk, or EMI.  In my posting of Dec. 13, 2012, I shared this
experiment:
I had a test board with a long length (~13.5", or 343mm) of a microstrip
differential pair which I believe mimics an aggressor-victim pair.

a.       I TDR'ed the traces single-endedly w/o modification as a
"baseline", observing the waveforms at the 4 ports as TDR, TDT, NEXT, and
FEXT.  As expected for microstrip w/ lots of coupling, there was significant
NEXT and FEXT. 

b.      I then put a strip of copper tape over a portion of the microstrip
traces, to mimic a VDDQ plane adjacent to the signal traces which are
referenced to "GND".  There was no DC connection between this copper shape
and "GND".  The copper tape is very close to the traces (thickness of the
soldermask), probably quite a bit closer than the traces are to the "GND"
plane (dielectric thickness probably about 5 mils).

c.       Again, I TDR'ed the traces single-endedly.  As expected for
stripline, FEXT was dramatically reduced, NEXT was somewhat reduced for the
portion under the copper tape. 

d.      I then cut off a portion the copper tape with scissors - nothing
very precise.

e.      This reduced the length of stripline portion, increasing FEXT, and
changing the time at which NEXT decreased.

f.        I then replaced the portion of tape I had cut off, very close, but
probably not closer than our typical 5-10 mil gap between shapes, to that
which was still on the board.  I checked that there was no DC continuity
between the two copper tape shapes.  This mimicked (to my mind) a VDDQ plane
split between 2 VDDQ shapes.

g.       TDR'ing this and comparing it to that of a single plane showed:

                                                               i.      The
difference in TDR was slight, and I attribute the difference to the slight
differences in how the tape was applied (it is not going to sit down as well
after being peeled off and reapplied)

                                                             ii.
Similar small differences in NEXT

                                                            iii.      Very
slight, but measureable, differences in FEXT and Tp.  While measureable, I
consider the difference in FEXT to be insignificant.  I also don't know if
the trend would continue if I tried this many times.

                                                           iv.      Perhaps
this would be grossly exacerbated by TDR'ing many signals simultaneously,
but I'm skeptical.  When I tried to mimic that in the past for similar
scenarios, I have not been successful.

This indicated (to me) that crossing plane splits did not introduce
significant impedance discontinuity or crosstalk (or, I assume, EMI).
Pictures of the waveforms are available at
https://www.filesanywhere.com/fs/v.aspx?v=8b6a6b8f61616e7aa0a2.

 

My experience indicates that, for designs I'm familiar with, noise coupling
is the primary worrisome agent when referencing signals to anything other
than ground.  This might be different for 4-layer designs with less
inter-plane capacitance, but I don't think that referencing to something
other than "ground" is necessarily precluded.

 

I look forward to hearing of your specifics; perhaps it will shed some light
on exactly when it is a problem.

 

Thanks,

Jeff Loyer

 

 

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Mustafa Yousuf
Sent: Sunday, August 04, 2013 2:41 PM
To: bala89si@xxxxxxxxx; si-list@xxxxxxxxxxxxx
Cc: yousufs432@xxxxxxxxx
Subject: [SI-LIST] Re: Return current of a trace in stripline

 

Hi Bala,

 

The return current is always split between the reference planes on both
sides of the trace. The farther the plane the less is the return current
flowing in that plane. From experience, in order for the return current to
flow in the closest reference plane, the other plane distance from the trace
should in the order 3-4 times as big as  the distance of the closer plane.

In this case you have two issues: 

                1. both planes are almost at the same distance (3.7 and 4.3
mils) from the stripline, so the return current will be split  almost
equally between the two.

                2. The split in the power plane will cause serious problems.
The return current will look for the path of least inductance and you don't
know where that would be. It may very well hit a critical signal far away
from your original signal and result in significant cross talk to  the other
signal which may be safe otherwise. 

We had serious issues in similar situation (in DDR) as you described that
caused failure of the memory. Hence you should be concerned about this case.

 

Thanks,

 

Mustafa

 

 

 

-----Original Message-----

From:  <mailto:si-list-bounce@xxxxxxxxxxxxx> si-list-bounce@xxxxxxxxxxxxx [
<mailto:si-list-bounce@xxxxxxxxxxxxx> mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Balaji G

Sent: Sunday, August 04, 2013 11:43 AM

To:  <mailto:si-list@xxxxxxxxxxxxx> si-list@xxxxxxxxxxxxx

Subject: [SI-LIST] Return current of a trace in stripline

 

Hi Experts,

  We discussed a lot regarding path of return current before and this is
regarding the path of return current in a stripline trace. As far I learnt,
the return current will take the path of least resistance at low frequencies
and path of less inductance at high frequency and hence the reason that
return current travels in the plane directly under the signal's trace. My
question is if we consider a signal travelling in a stripline which is
sandwiched between the ground and split power plane where the signal to
ground distance is 3.7mils and signal to split power plane distance is
4.3mils, should we worry about the split power plane at high frequency (say

3GHz) as the signal to ground distance is the path of least inductance and
all the return current for high frequency signal trace flows in the ground
plane causing no reflection/ EMI issues? Is my thinking right?  Can you
please provide your thoughts on this?

 

Regards,

 

Balaji

 

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