Hey Fabrizio, I've always thought about SSO noise and decoupling as separate problems, i.e. design your power distribution system to some ripple spec (say 5% of Vdd) and then make sure your quiet line SSO noise never gets larger than some limit (say 20% of Vdd). In my mind, these numbers are always a determined by my noise budget - keeping in mind that worst-case SSO noise and worst-case bus timing usually don't coincide. My method may be a bit old-fashioned, and you bring up an interesting point: can you analyze these two problems together? I am not aware of a tool that can do this. I've always used SPICE for SSO analysis of wire bonded packages, and Speed seems to be the most sophisticated tool for analyzing the complex decoupling problem. I don't put a whole lot of stock in simplistic, back-of-the-envelope decoupling theories because they have led me astray in the past. From what you've said about your particular problem, it sounds like a classical SSO problem that will be dominated by the bond wire inductance and the driver di/dt, assuming you have a solid PSD leading up to the package. Therefore, focus on getting the right signal-to-return ratio when you assign the chip I/Os, and don't use a driver that is any faster than you absolutely need it to be. And of course, watch out for those IBIS models of drivers that have some kind of whiz-bang compensation circuitry! By the way, I have found that measuring SSO noise at the far end of a quiet line is the best way to confirm the goodness of your design. This assumes you have some way of forcing one of the signals on your bus to be static for a period of time while every other signal is switching. Cheers, Greg Edlund Senior Engineer Signal Integrity IBM Engineering and Technology Services 3605 Hwy. 52 N, Dept. HDC Rochester, MN 55901 gedlund@xxxxxxxxxx Msg: #1 in digest Subject: [SI-LIST] Reducing SSO noise in an FPGA Date: Wed, 25 Jun 2003 12:01:31 -0400 From: "Fabrizio Zanella" <fzanella@xxxxxxxxxxxx> I would like to hear about experiences regarding methods of reducing simultaneous switching noise in a large FPGA, BGA package. Let's assume a 128bit bus, with a signal frequency of 100MHz. How effective is adding ground planes 2 mils from the VCC planes in reducing SSN? If one uses BC, does every VCC pin in the FPGA require decoupling? And should the caps be tied to the BGA pins with blind vias so they can be placed directly under the BGA? What are the optimal values for the decoupling capacitors, 0.1uf, 0.22uF? Thanks very much and regards, Fabrizio Zanella Principal Hardware Design Engineer Broadbus Technologies fzanella@xxxxxxxxxxxx ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu