Hi Hakim:
As long as you're using stitching, as you said, I don't know of an argument
against ground pours in a "subtractive" etching scenario.
Going beyond your patch antenna comment, copper pours can also provide a return
path for adjacent high-speed signals - and potential shielding for differential
radiation, if that's a concern.
As you said, this approach often gets used to balance copper in the stackup, as
well, which is a good thing.
I'd love to hear the counterpoint ... Maybe I'm overlooking something, but I'm
not thinking of one.
Bill Hargin
Director of Everything
Z-zero ▪ Innovative PCB Stackup Design ▪ www.z-zero.com
billh@xxxxxxxxxx ▪ 425-301-4425 ▪ Skype: bill.hargin
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx <si-list-bounce@xxxxxxxxxxxxx> On Behalf Of
Hakim Sellaoui
Sent: Tuesday, July 30, 2019 7:56 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Gnd pours
Hello all,
What are your views on gnd pours in multi-layered PCBs (even on top/bottom),
assuming everything is stitched to lamda/8 or /10 etc.
I think it's better to have it as it would reduce the amount of etching the PCB
fab, and thus I'll get a board closer to what my given stackup. Furthermore,
in most cases the PCB adds copper balancing should I not add the pours.
I understand there could be risks of creating patch antennas, but would this
not be mitigated with stitching?
Kind regards,
--
Hakim Sellaoui
Hardware Engineer
DisplayLink (UK) Limited
Tel: +44 (0)1223 443920
DD: +44 (0)1223 443943
Fax: +44 (0)1223 443921
E: hakim.sellaoui@xxxxxxxxxxxxxxx<mailto:hakim.sellaoui@xxxxxxxxxxxxxxx>
W: http://www.displaylink.com/<http://www.displaylink.com/>
140 Science Park, Milton Road,
Cambridge, CB4 0GF,
United Kingdom.
Registered in England No. 04811048
DisplayLink Corp.
A US incorporated company.
480 S. California Avenue Ste 305, Palo Alto, CA 94306, USA.
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