[ibis-macro] Re: Straw Poll vote on IBIS-ISS Package Modeling

  • From: "Muranyi, Arpad" <Arpad_Muranyi@xxxxxxxxxx>
  • To: IBIS-ATM <ibis-macro@xxxxxxxxxxxxx>
  • Date: Wed, 15 Aug 2012 15:46:26 +0000

Greg,

Thanks for your comments.  Like you, I would like to see
more comments from other users too.

But to answer your question, “along with a document saying "use this model for 
these pins"”
is what we would like to make the .ibs and/or .pkg file
to do for you (based on a standardized specification),
so that you won’t have to do it by hand.  Does that make
sense?

As an illustration I would say that we want to make a
specification which allows model vendors to send you a
machine readable netlist instead of a Word document
that describes what the circuit looks like…

Thanks,

Arpad
==========================================================

From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] 
On Behalf Of Gregory R Edlund
Sent: Wednesday, August 15, 2012 10:29 AM
To: wkatz@xxxxxxxxxx; IBIS-ATM; ibis-macro-bounce@xxxxxxxxxxxxx
Subject: [ibis-macro] Re: Straw Poll vote on IBIS-ISS Package Modeling


Here's one user's perspective:

I'm happy getting .s4p files from my chip suppliers along with a document 
saying "use this model for these pins" (among other things).  And if coupling 
is worth simulating, then I'm happy with an .s12p file.  I can get along 
without a CAD file to tell me how to hook up the s-parameters in the EDA tool.  
Or is there something else going on that I'm not seeing?

To me, it seems like there are bigger fish to fry, e.g. getting IBIS 5.1 out 
the door, jitter modeling, error reporting when a DLL crashes, etc.

Any other users care to weigh in?

Greg Edlund
Senior Engineer
Signal Integrity and System Timing
IBM Systems & Technology Group
3605 Hwy. 52 N  Bldg 050-3
Rochester, MN 55901



[Inactive hide details for "Walter Katz" ---08/14/2012 04:24:02 
PM---[attachment "IBIS_ISS_Package_Modeling_120807.pdf" deleted]"Walter Katz" 
---08/14/2012 04:24:02 PM---[attachment "IBIS_ISS_Package_Modeling_120807.pdf" 
deleted by Gregory R Edlund/Rochester/IBM]  [atta

From: "Walter Katz" <wkatz@xxxxxxxxxx<mailto:wkatz@xxxxxxxxxx>>
To: "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx<mailto:ibis-macro@xxxxxxxxxxxxx>>
Date: 08/14/2012 04:24 PM
Subject: [ibis-macro] Straw Poll vote on IBIS-ISS Package Modeling
Sent by: ibis-macro-bounce@xxxxxxxxxxxxx<mailto:ibis-macro-bounce@xxxxxxxxxxxxx>

________________________________


[attachment "IBIS_ISS_Package_Modeling_120807.pdf" deleted by Gregory R 
Edlund/Rochester/IBM]
[attachment "IBIS_ISS_Package_Modeling_Discussion_1_120814.pdf" deleted by 
Gregory R Edlund/Rochester/IBM]
[attachment "PackageFunctionalityStrawPoll.xlsx" deleted by Gregory R 
Edlund/Rochester/IBM]

All,

I have put 28 questions in a spreadsheet. I think it will take too much time to 
do the voting in the meeting, so I request that you put entries 1:4 in column 1 
of each question. The meanings of 1:4 are.

4

Advocate   I need this!

3

Support      I support this

2

Abstain       I have no opinion

1

Object         I object to this functionality



Return them to me or all IBIS-ATM and I will collate the results and publish 
them by Tuesday AM. I am including the .xlsx file in case you have difficulty 
editing the spreadsheet in the body of this e-mail. Also including this and 
last weeks presentation.

Walter

4

Advocate   I need this!

3

Support      I support this

2

Abstain       I have no opinion

1

Object         I object to this functionality







Should we add keywords Pullup_Signal_name, Pulldown_Signal_name, 
Power_clamp_Signal_name, and Ground_clamp_Signal_name to the [Model] section?



Should we add a section to the .ibs file to define the voltage values of supply 
signal names?



Should we add a list of supply die pad names?



Should we add an x-y coordinate for each pin and die pad?







Should we support two signal pins connected to the same die pad (Forked Signal)?



Should we be able to associate a package model with a [Model]?



Should we be able to associate a package model with a Pin_name?



Should we be able to associate a coupled package model with a [Model]?



Should we be able to associate a coupled package model with a list of Pin_names?



Should we support package models with coupling between signals and power?



Should we support a coupled package model that hooks up to two or more [Model] 
names?



Should we support package models with more than 3 corners?



Should we support package Touchstone files directly?



Should we support sparse usage of large package Touchstone files?



Should we support package “Quadrants” (e.g. Banks, Interfaces)?



Should we support full package models?







Should we support on-die models?



Should we be able to associate an on-die model with a [Model]?



Should we be able to associate an on-die model with a Pin_name?



Should we be able to associate a coupled on-die model with a [Model]?



Should we be able to associate a coupled on-die model with a list of Pin_names?



Should we support on-die models with coupling between signals and power?



Should we support a coupled on-die model that hooks up to two or more [Model] 
names?



Should we support on-die models with more than 3 corners?



Should we support on-die Touchstone files directly?



Should we support sparse usage of large on-die Touchstone files?



Should we support on-die “Quadrants” (e.g. Banks, Interfaces)?



Should we support full on-die models?




Walter Katz
wkatz@xxxxxxxxxx<mailto:wkatz@xxxxxxxxxx>
Phone 303.449-2308
Mobile 303.335-6156

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