Zhangkun, Ludovic, Yes, the vertical coupling between power planes one above the other at high frequencies is strong. If, however, the coupled rails are designed to be resonance free, and they have similar characteristics (impedance, allowed noise, bandwidth), the coupling does not create special problems. As Larry pointed out, a nice feature about the stackup in question is that the power planes are sandwiched between grounds, so radiation from the noisy power plane is less of an issue,and signal traces all reference ground planes. This building block takes four layers though, and therefore very seldom can we afford to have two of these; one close to each surface of the board; it usually ends up in the middle of the stackup. If that is the case, be prepared to live with the increased via inductance connecting the planes to the surface. As Zhangkun pointed out, one way to decrease the vertical coupling is to increase the relative separation between the two power planes. This can be done by either increasing the absolute separation vertically between the two power planes, or reducing the separation between the power planes and ground planes, or a combination of both. Increasing the absolute separation between the power planes is practically free within the maximum board thickness limit you have on hand. Reducing the power-ground plane separation to less than 4 mils is also doable; down to about 3 mils is practically free. Thinner laminates down to 1 mil and 0.5 mil thicknesses are now also commercially available. Playing with the vertical separation has its limits. If, say, we assume a maximum vertical separation between the power planes to be 50 mils and a 0.5 mil power-ground separation, the resulting capacitive divider at high frequencies results in an about 100:1 noise separation. Even in this extreme case this would be barely enough to isolate a sensitive analog puddle from a very noisy logic rail (in this case we assume that the very noisy logic rail in itself would be OK). In such cases a better solution is to move the very different supply rails away from each other horizontally so that vertical coupling does not occur, or move the sensitive rail (hopefully small in size) to another (say signal) layer. Regards, Istvan Zhangkun wrote: >Dear Ludovic > >I have made a similar PCB of your stackup. The noise coupling between VCC1 and >VCC2 is serious. I suggest that the seperation between VCC1 and VCC2 to be >large. > >Best Regards > >Zhangkun >2005.10.24 >----- Original Message ----- >From: "Ludovic Levieil" <ludovic.levieil@xxxxxxxxxxx> >To: <si-list@xxxxxxxxxxxxx> >Sent: Thursday, October 20, 2005 4:12 PM >Subject: [SI-LIST] Power plane coupling > > > > >>Hello All, >>In my current board design I have the following stack up: >> >> ....... >>---------------- GND (solid plane) >>------ ----- --- VCC1 (splitted plane) >>--- ----- ------ VCC2 (splitted plane) >>---------------- GND (solid plane) >> ....... >> >>4 mils separate GND and VCC planes >>5 mils separate VCC1 and VCC2 planes >> >>Both VCC planes are splitted in different power domains and I am wondering >>: >> - if having two coupled VCC planes is good/acceptable when >>thinking about noise ?? >> - if there is a problem in having one power domain on on plane >>overlapping at least two power domains on the other plane ?? >> >>Thanks >> >>Ludovic Levieil >> >> >> ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu