THANK U ALL On Tue, Jul 7, 2009 at 4:01 PM, Maqbool, Mashak (GE Infra, Energy) < mashak.maqbool@xxxxxx> wrote: > No BB technology is not yet in India. > > > > ------------------------------ > *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto: > icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Sakthivel > *Sent:* Tuesday, July 07, 2009 3:35 PM > > *To:* icu-pcb-forum@xxxxxxxxxxxxx > *Subject:* [PCB_FORUM] Re: Via-in-Pad > > Hi, > Thanks for ur reply... > > In my design i am using 0.5 mm pitch BGA. I am using 5 mil drill > via. I am using Blind Buried vias also. > > is it possible to manufacture in INDIA....? > > > > On Tue, Jul 7, 2009 at 2:15 PM, Ramachandra KG > <ramachandra.kg@xxxxxxxxx>wrote: > >> well, >> question again now is whether you want those via holes filled with >> conductive or non-conductive epoxy? or you just want to leave it as it is... >> >> Yes, Hi-Q can do via on pad, but they have a limit on drill size of 8 >> mils. So if your BGA is 0.5mm and you are planning to go for via in pad, i >> guess it might not work for u. >> >> On Tue, Jul 7, 2009 at 1:57 PM, Maqbool, Mashak (GE Infra, Energy) < >> mashak.maqbool@xxxxxx> wrote: >> >>> Hi, >>> >>> Yes HI-Q Electronics Bangalore does that. >>> >>> Regards, >>> Mashak >>> >>> ------------------------------ >>> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto: >>> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Sakthivel >>> *Sent:* Tuesday, July 07, 2009 1:52 PM >>> *To:* icu-pcb-forum@xxxxxxxxxxxxx >>> *Subject:* [PCB_FORUM] Re: Via-in-Pad >>> >>> Hi, >>> Is there any manufacturer in *INDIA* who is having the capability >>> to manufacture Via in Pad Design.........? >>> >>> >>> On Sun, Jul 5, 2009 at 3:37 AM, V S <for_si2003@xxxxxxxxx> wrote: >>> >>>> >>>> Via in Pad may reduce the number of layers required to accomplish the >>>> dense routing. It can also reduce the via discontinuity presented in the >>>> breakout region. >>>> >>>> Via in pad however, increases the manufacturing cost as all the >>>> manufacturer do not have that capability. >>>> >>>> Usually via in pad may be an essential requirement if your BGA pitch is >>>> 0.5 mm or less. If the BGA pitch is 0.65 mm or larger you may not need Via >>>> in pad. >>>> >>>> You may like to see the book - "Signal Integrity for PCB Designers", by >>>> Vikas Shukla available at Amazon. >>>> >>>> If you want more information you may search for the relevant expert at >>>> http://ezdia.com and ask the question to the expert. >>>> >>>> >>>> --- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote: >>>> >>>> > From: karthik r <pcbtech4me@xxxxxxxxx> >>>> > Subject: [PCB_FORUM] Via-in-Pad >>>> > To: icu-pcb-forum@xxxxxxxxxxxxx >>>> > Date: Saturday, July 4, 2009, 5:35 AM >>>> > Hi all, >>>> > >>>> > Can someone explain me the advantages & >>>> > dis-advantages in using a Via-in-Pad technique, both design >>>> > & manufacturing perspective. >>>> > >>>> > Also the points to be taken care while doing so. >>>> > >>>> > Thanks in advance !!!! >>>> > >>>> > Regards, >>>> > Karthik >>>> > >>>> >>>> >>>> >>>> ----------------------------------------------------------- >>>> To subscribe/unsubscribe: >>>> Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx >>>> with a subject of subscribe or unsubscribe >>>> >>>> To view the archives of this list go to >>>> //www.freelists.org/archives/icu-pcb-forum/ >>>> >>>> Problems or Questions: >>>> Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx >>>> ----------------------------------------------------------- >>>> >>> >>> >>> >>> -- >>> REGARDS >>> >>> S.Sakthivel >>> >>> I'm not the best >>> but I'm not like the rest >>> >> >> > > > -- > REGARDS > > S.Sakthivel > > I'm not the best > but I'm not like the rest > -- REGARDS S.Sakthivel I'm not the best but I'm not like the rest