[PCB_FORUM] Re: Via-in-Pad

Via in Pad may reduce the number of layers required to accomplish the dense 
routing. It can also reduce the via discontinuity presented in the breakout 
region.

Via in pad however, increases the manufacturing cost as all the manufacturer do 
not have that capability.

Usually via in pad may be an essential requirement if your BGA pitch is 0.5 mm 
or less. If the BGA pitch is 0.65 mm or larger you may not need Via in pad.

You may like to see the book - "Signal Integrity for PCB Designers", by Vikas 
Shukla available at Amazon.

If you want more information you may search for the relevant expert at 
http://ezdia.com and ask the question to the expert.


--- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote:

> From: karthik r <pcbtech4me@xxxxxxxxx>
> Subject: [PCB_FORUM] Via-in-Pad
> To: icu-pcb-forum@xxxxxxxxxxxxx
> Date: Saturday, July 4, 2009, 5:35 AM
> Hi all,
>  
> Can someone explain me the advantages &
> dis-advantages in using a Via-in-Pad technique, both design
> & manufacturing perspective. 
>  
> Also the points to be taken care while doing so.
>  
> Thanks in advance !!!!
>  
> Regards,
> Karthik
> 


      
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