[PCB_FORUM] Re: Via-in-Pad
- From: Sakthivel <sakthivel2405@xxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Tue, 7 Jul 2009 16:19:15 +0530
THANK U ALL
On Tue, Jul 7, 2009 at 4:01 PM, Maqbool, Mashak (GE Infra, Energy) <
mashak.maqbool@xxxxxx> wrote:
> No BB technology is not yet in India.
>
>
>
> ------------------------------
> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Sakthivel
> *Sent:* Tuesday, July 07, 2009 3:35 PM
>
> *To:* icu-pcb-forum@xxxxxxxxxxxxx
> *Subject:* [PCB_FORUM] Re: Via-in-Pad
>
> Hi,
> Thanks for ur reply...
>
> In my design i am using 0.5 mm pitch BGA. I am using 5 mil drill
> via. I am using Blind Buried vias also.
>
> is it possible to manufacture in INDIA....?
>
>
>
> On Tue, Jul 7, 2009 at 2:15 PM, Ramachandra KG
> <ramachandra.kg@xxxxxxxxx>wrote:
>
>> well,
>> question again now is whether you want those via holes filled with
>> conductive or non-conductive epoxy? or you just want to leave it as it is...
>>
>> Yes, Hi-Q can do via on pad, but they have a limit on drill size of 8
>> mils. So if your BGA is 0.5mm and you are planning to go for via in pad, i
>> guess it might not work for u.
>>
>> On Tue, Jul 7, 2009 at 1:57 PM, Maqbool, Mashak (GE Infra, Energy) <
>> mashak.maqbool@xxxxxx> wrote:
>>
>>> Hi,
>>>
>>> Yes HI-Q Electronics Bangalore does that.
>>>
>>> Regards,
>>> Mashak
>>>
>>> ------------------------------
>>> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
>>> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Sakthivel
>>> *Sent:* Tuesday, July 07, 2009 1:52 PM
>>> *To:* icu-pcb-forum@xxxxxxxxxxxxx
>>> *Subject:* [PCB_FORUM] Re: Via-in-Pad
>>>
>>> Hi,
>>> Is there any manufacturer in *INDIA* who is having the capability
>>> to manufacture Via in Pad Design.........?
>>>
>>>
>>> On Sun, Jul 5, 2009 at 3:37 AM, V S <for_si2003@xxxxxxxxx> wrote:
>>>
>>>>
>>>> Via in Pad may reduce the number of layers required to accomplish the
>>>> dense routing. It can also reduce the via discontinuity presented in the
>>>> breakout region.
>>>>
>>>> Via in pad however, increases the manufacturing cost as all the
>>>> manufacturer do not have that capability.
>>>>
>>>> Usually via in pad may be an essential requirement if your BGA pitch is
>>>> 0.5 mm or less. If the BGA pitch is 0.65 mm or larger you may not need Via
>>>> in pad.
>>>>
>>>> You may like to see the book - "Signal Integrity for PCB Designers", by
>>>> Vikas Shukla available at Amazon.
>>>>
>>>> If you want more information you may search for the relevant expert at
>>>> http://ezdia.com and ask the question to the expert.
>>>>
>>>>
>>>> --- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote:
>>>>
>>>> > From: karthik r <pcbtech4me@xxxxxxxxx>
>>>> > Subject: [PCB_FORUM] Via-in-Pad
>>>> > To: icu-pcb-forum@xxxxxxxxxxxxx
>>>> > Date: Saturday, July 4, 2009, 5:35 AM
>>>> > Hi all,
>>>> >
>>>> > Can someone explain me the advantages &
>>>> > dis-advantages in using a Via-in-Pad technique, both design
>>>> > & manufacturing perspective.
>>>> >
>>>> > Also the points to be taken care while doing so.
>>>> >
>>>> > Thanks in advance !!!!
>>>> >
>>>> > Regards,
>>>> > Karthik
>>>> >
>>>>
>>>>
>>>>
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>>>>
>>>
>>>
>>>
>>> --
>>> REGARDS
>>>
>>> S.Sakthivel
>>>
>>> I'm not the best
>>> but I'm not like the rest
>>>
>>
>>
>
>
> --
> REGARDS
>
> S.Sakthivel
>
> I'm not the best
> but I'm not like the rest
>
--
REGARDS
S.Sakthivel
I'm not the best
but I'm not like the rest
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