[PCB_FORUM] Re: Via-in-Pad
- From: Sakthivel <sakthivel2405@xxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Tue, 7 Jul 2009 15:34:58 +0530
Hi,
Thanks for ur reply...
In my design i am using 0.5 mm pitch BGA. I am using 5 mil drill
via. I am using Blind Buried vias also.
is it possible to manufacture in INDIA....?
On Tue, Jul 7, 2009 at 2:15 PM, Ramachandra KG <ramachandra.kg@xxxxxxxxx>wrote:
> well,
> question again now is whether you want those via holes filled with
> conductive or non-conductive epoxy? or you just want to leave it as it is...
>
> Yes, Hi-Q can do via on pad, but they have a limit on drill size of 8 mils.
> So if your BGA is 0.5mm and you are planning to go for via in pad, i guess
> it might not work for u.
>
> On Tue, Jul 7, 2009 at 1:57 PM, Maqbool, Mashak (GE Infra, Energy) <
> mashak.maqbool@xxxxxx> wrote:
>
>> Hi,
>>
>> Yes HI-Q Electronics Bangalore does that.
>>
>> Regards,
>> Mashak
>>
>> ------------------------------
>> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
>> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *Sakthivel
>> *Sent:* Tuesday, July 07, 2009 1:52 PM
>> *To:* icu-pcb-forum@xxxxxxxxxxxxx
>> *Subject:* [PCB_FORUM] Re: Via-in-Pad
>>
>> Hi,
>> Is there any manufacturer in *INDIA* who is having the capability
>> to manufacture Via in Pad Design.........?
>>
>>
>> On Sun, Jul 5, 2009 at 3:37 AM, V S <for_si2003@xxxxxxxxx> wrote:
>>
>>>
>>> Via in Pad may reduce the number of layers required to accomplish the
>>> dense routing. It can also reduce the via discontinuity presented in the
>>> breakout region.
>>>
>>> Via in pad however, increases the manufacturing cost as all the
>>> manufacturer do not have that capability.
>>>
>>> Usually via in pad may be an essential requirement if your BGA pitch is
>>> 0.5 mm or less. If the BGA pitch is 0.65 mm or larger you may not need Via
>>> in pad.
>>>
>>> You may like to see the book - "Signal Integrity for PCB Designers", by
>>> Vikas Shukla available at Amazon.
>>>
>>> If you want more information you may search for the relevant expert at
>>> http://ezdia.com and ask the question to the expert.
>>>
>>>
>>> --- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote:
>>>
>>> > From: karthik r <pcbtech4me@xxxxxxxxx>
>>> > Subject: [PCB_FORUM] Via-in-Pad
>>> > To: icu-pcb-forum@xxxxxxxxxxxxx
>>> > Date: Saturday, July 4, 2009, 5:35 AM
>>> > Hi all,
>>> >
>>> > Can someone explain me the advantages &
>>> > dis-advantages in using a Via-in-Pad technique, both design
>>> > & manufacturing perspective.
>>> >
>>> > Also the points to be taken care while doing so.
>>> >
>>> > Thanks in advance !!!!
>>> >
>>> > Regards,
>>> > Karthik
>>> >
>>>
>>>
>>>
>>> -----------------------------------------------------------
>>> To subscribe/unsubscribe:
>>> Send a message to icu-pcb-forum-request@xxxxxxxxxxxxx
>>> with a subject of subscribe or unsubscribe
>>>
>>> To view the archives of this list go to
>>> //www.freelists.org/archives/icu-pcb-forum/
>>>
>>> Problems or Questions:
>>> Send an email to icu-pcb-forum-admins@xxxxxxxxxxxxx
>>> -----------------------------------------------------------
>>>
>>
>>
>>
>> --
>> REGARDS
>>
>> S.Sakthivel
>>
>> I'm not the best
>> but I'm not like the rest
>>
>
>
--
REGARDS
S.Sakthivel
I'm not the best
but I'm not like the rest
Other related posts:
