[PCB_FORUM] Re: Via-in-Pad

Hi,
      Is there any manufacturer in *INDIA* who is having the capability to
manufacture Via in Pad Design.........?


On Sun, Jul 5, 2009 at 3:37 AM, V S <for_si2003@xxxxxxxxx> wrote:

>
> Via in Pad may reduce the number of layers required to accomplish the dense
> routing. It can also reduce the via discontinuity presented in the breakout
> region.
>
> Via in pad however, increases the manufacturing cost as all the
> manufacturer do not have that capability.
>
> Usually via in pad may be an essential requirement if your BGA pitch is 0.5
> mm or less. If the BGA pitch is 0.65 mm or larger you may not need Via in
> pad.
>
> You may like to see the book - "Signal Integrity for PCB Designers", by
> Vikas Shukla available at Amazon.
>
> If you want more information you may search for the relevant expert at
> http://ezdia.com and ask the question to the expert.
>
>
> --- On Sat, 7/4/09, karthik r <pcbtech4me@xxxxxxxxx> wrote:
>
> > From: karthik r <pcbtech4me@xxxxxxxxx>
> > Subject: [PCB_FORUM] Via-in-Pad
> > To: icu-pcb-forum@xxxxxxxxxxxxx
> > Date: Saturday, July 4, 2009, 5:35 AM
> > Hi all,
> >
> > Can someone explain me the advantages &
> > dis-advantages in using a Via-in-Pad technique, both design
> > & manufacturing perspective.
> >
> > Also the points to be taken care while doing so.
> >
> > Thanks in advance !!!!
> >
> > Regards,
> > Karthik
> >
>
>
>
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-- 
REGARDS

S.Sakthivel

I'm not the best
but I'm not like the rest

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