[PCB_FORUM] Re: Via-in-Pad
- From: "Maqbool, Mashak (GE Infra, Energy)" <mashak.maqbool@xxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Tue, 7 Jul 2009 16:01:16 +0530
No BB technology is not yet in India.
________________________________
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Sakthivel
Sent: Tuesday, July 07, 2009 3:35 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: Via-in-Pad
Hi,
Thanks for ur reply...
In my design i am using 0.5 mm pitch BGA. I am using 5 mil
drill via. I am using Blind Buried vias also.
is it possible to manufacture in INDIA....?
On Tue, Jul 7, 2009 at 2:15 PM, Ramachandra KG
<ramachandra.kg@xxxxxxxxx> wrote:
well,
question again now is whether you want those via holes filled
with conductive or non-conductive epoxy? or you just want to leave it as
it is...
Yes, Hi-Q can do via on pad, but they have a limit on drill size
of 8 mils. So if your BGA is 0.5mm and you are planning to go for via in
pad, i guess it might not work for u.
On Tue, Jul 7, 2009 at 1:57 PM, Maqbool, Mashak (GE Infra,
Energy) <mashak.maqbool@xxxxxx> wrote:
Hi,
Yes HI-Q Electronics Bangalore does that.
Regards,
Mashak
________________________________
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of Sakthivel
Sent: Tuesday, July 07, 2009 1:52 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: Via-in-Pad
Hi,
Is there any manufacturer in INDIA who is having
the capability to manufacture Via in Pad Design.........?
On Sun, Jul 5, 2009 at 3:37 AM, V S
<for_si2003@xxxxxxxxx> wrote:
Via in Pad may reduce the number of layers
required to accomplish the dense routing. It can also reduce the via
discontinuity presented in the breakout region.
Via in pad however, increases the manufacturing
cost as all the manufacturer do not have that capability.
Usually via in pad may be an essential
requirement if your BGA pitch is 0.5 mm or less. If the BGA pitch is
0.65 mm or larger you may not need Via in pad.
You may like to see the book - "Signal Integrity
for PCB Designers", by Vikas Shukla available at Amazon.
If you want more information you may search for
the relevant expert at http://ezdia.com <http://ezdia.com/> and ask the
question to the expert.
--- On Sat, 7/4/09, karthik r
<pcbtech4me@xxxxxxxxx> wrote:
> From: karthik r <pcbtech4me@xxxxxxxxx>
> Subject: [PCB_FORUM] Via-in-Pad
> To: icu-pcb-forum@xxxxxxxxxxxxx
> Date: Saturday, July 4, 2009, 5:35 AM
> Hi all,
>
> Can someone explain me the advantages &
> dis-advantages in using a Via-in-Pad
technique, both design
> & manufacturing perspective.
>
> Also the points to be taken care while doing
so.
>
> Thanks in advance !!!!
>
> Regards,
> Karthik
>
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--
REGARDS
S.Sakthivel
I'm not the best
but I'm not like the rest
--
REGARDS
S.Sakthivel
I'm not the best
but I'm not like the rest
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