Here's one bit of information: I'm planning to re-ball a new 484 ball BGA part we will be using since Lattice Semiconductor refuses to make the part in tin/lead. I have investigated the options and it is very clear to me that using tin/lead solderpaste with lead-free solderballs is a no-no. Polina Snugovsky at Celestica has studied this subject a lot and it's clear from her paper that the process reflow window is very tight (you have to raise the temp to melt the SAC balls). Too risky. http://www.hlinstruments.com//RoHS_articles/Solder%20Joint%20Reliability%20of%20Pb-free%20Sn-Ag-Cu%20BGA%20in%20SnPb.pdf Now if I can just get some parts in less than 22 weeks! Not happy about this situation; Lattice seems to have me by the ..... Bob Landman H&L Instruments, LLC -----Original Message----- From: tinwhiskers-bounce@xxxxxxxxxxxxx [mailto:tinwhiskers-bounce@xxxxxxxxxxxxx] On Behalf Of Rod Sent: Thursday, July 29, 2010 9:24 AM To: tinwhiskers@xxxxxxxxxxxxx Subject: [tinwhiskers] Re: Not receiving any email's re tin whiskers for the last two months On 29 Jul 2010, at 01:19, Randall Miller wrote: > Me neither, but I didn't notice until you mentioned it. > There are always plenty of things to occupy my feeble brain to not > notice something missing. Well, it depends on someone finding something worth saying. regards, Rod rod.dalitz@xxxxxxxxxxxxxxxx