Can the capacitance realized by embedding capacitance in the PCB stackup
replace discrete decoupling capacitors?
Let's say the discrete decoupling solution for a processor's Vcore rail has
thirty 0.22 uf Hi-F caps. Is there a practical way to use an embedded passives
approach in the PCB stackup to achieve the needed decoupling capacitance and
thus remove these thirty discrete capacitors?
If so, are there any papers published around this? (I've searched and can't
find anything substantial on replacing discrete ceramic capacitors with
embedded PCB capacitance.)
Thanks,
Jim Peterson
Honeywell Aero
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