[SI-LIST] Re: GND Separation for Analog & Digital circuits
- From: Chris Cheng <Chris.Cheng@xxxxxxxxxxxx>
- To: "'jrbarnes@xxxxxxxxx'" <jrbarnes@xxxxxxxxx>,psalmon2000@xxxxxxxxx, si-list@xxxxxxxxxxxxx
- Date: Wed, 25 Feb 2004 11:41:11 -0800
John,
What do all these MCM papers promoting mesh power distribution to do with
PCB power distribution design ?
There are many reasons why MCM or ultra fine pitch substrates use meshed
power/gnd planes. They vary from degassing requirements on organic substrate
to via and interconnect constrain like IBM TCM. However, they are
fundamentally different to regular PCBs. I have design many MCM and fine
pitch packages and I have never seen a mesh design out perform electrically
over a conventional solid reference planes PCB. The practice came out from
process requirement more than performance enhancement. I don't see why it
should be promoted in places where it is not necessary.
-----Original Message-----
From: John Barnes [mailto:jrbarnes@xxxxxxxxx]
Sent: Wednesday, February 25, 2004 8:29 AM
To: psalmon2000@xxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: GND Separation for Analog & Digital circuits
Peter,
You may want to read up on the "Interconnected Mesh Power System
(IMPS)". I'm still updating my bibliography on Power Distribution on
Printed Circuit Boards ( http://www.dbicorporation.com/pwr-bib.htm
), but recently ran across the following pertinent papers:
* Glover, Michael D., and Schaper, Leonard W., "A Functional Module
Comparison of the Interconnected Mesh Power System (IMPS) with a
Standard Four-layer MCM Topology," <CITE>Proceedings 1996 IEEE
Multi-Chip Module Conference</CITE>, Santa Cruz, Feb. 6-7, 1996, pp.
143-146.
* Low, Yee L., Schaper, Len W., and Ang, Simon S., "A Low-Cost MCM
Design Topology-the Interconnected Mesh Power System (IMPS)," <CITE>
Proceedings 1995 Multi-Chip Module Conference</CITE>, Jan. 31-Feb.
2, 1995, pp. 200-205.
* Low, Yee L., Schaper, Leonard W., and Ang, Simon S., "Modeling and
Experimental Verification of the Interconnected Mesh Power System
(IMPS) MCM Topology," <CITE>IEEE Transactions on Components,
Packaging, and Manufacturing Technology - Part B</CITE>, vol. 20,
no. 1, pp. 42-49, Feb. 1997.
* Low, Yee L., and Frye, Robert C., "Signal Integrity and Power
Distribution Systems Analyses for a 4x4 ATM Switch MCM,"
<CITE>Proceedings of the 1997 International Conference on Multichip
Modules</CITE>, Denver, CO, Apr. 2-4, 1997, pp. 278-283.
* Low, Y. L., Schaper, L. W., Ang, S., and Oldham, D., "The
Interconnected Mesh Power System (IMPS) MCM Topology,"
<CITE>Proceedings of IEEE 3rd Topical Meeting on Electrical
Performance of Electronic Packaging </CITE>, Monterey, CA, Nov. 2-4,
1994, pp. 231-234.
* Parkerson, James Patrick, and Schaper, Leonard W., "Advanced
Interconnected Mesh Power System (IMPS) MCM Topologies,"
<CITE>Proceedings 1996 IEEE Multi-Chip Module Conference</CITE>,
Santa Cruz, CA, Feb. 6-7, 1996, pp. 123-126.
* Schaper, L. W., Ang, S., and Low, Y. L., "Design of the
Interconnected Mesh Power System (IMPS) MCM Topology,"
<CITE>Proceedings of the 1994 International Conference on Multichip
Modules</CITE>, Denver, CO, April 13-15, 1994, pp. 543-548.
* Schaper, L. W., Ang, S., Low, Yee L., and Oldham, Danny R.,
"Electrical Characterization of the Interconnected Mesh Power System
(IMPS) MCM Topology," <CITE>IEEE Transactions on Components, Hybrids,
and Manufacturing Tech - Part B</CITE>, vol. 18, no. 1, pp.
99-105, Feb. 1995.
* Schaper, L. W., Ang, S., Low, Y. L., and Oldham, D., "Electrical
Characterization of the Interconnected Mesh Power System (IMPS) MCM
Topology," <CITE>1994 Proceedings 44th Electronic Components &
Technology Conference</CITE>, Washington, D.C., May 1-4, 1994, pp.
791-795.
Gridding power and ground is a standard layout technique for
double-sided printed circuit boards. I discuss it in chapter 31,
"Designing Printed Circuit Boards", (specifically on pages 31-67 through
31-69) of my upcoming Robust Electronic Design Reference Book,
Volumes 1 and 2. Kluwer Academic Publishers expects to have my book in
print in late March (
http://www.wkap.nl/prod/b/1-4020-7739-4,
http://www.wkap.nl/prod/b/1-4020-7739-4?a=2,
http://www.dbicorporation.com/book-out.htm,
http://www.dbicorporation.com/errata.htm ).
John Barnes KS4GL, PE, NCE, ESDC Eng, SM IEEE
dBi Corporation
http://www.dbicorporation.com/
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