Hello Hermann, Thanks for your ideas. I absolutely agree with all your points. I simulated with different end termination values for DDR3 clock. Currently the parallel termination value is set at 49.9 ohms. Reducing the termination value improves the signal quality at all DRAMs, even at die. However, I will do careful analysis in obtaining good clock signal at all DRAMs. Like you said, fly-by topology requires careful optimization, simulation and verification. Thanks, Pugazh -----Original Message----- From: Hermann Ruckerbauer [mailto:hermann.ruckerbauer@xxxxxxxxxxxxx] Sent: Monday, October 31, 2011 4:36 PM To: si-list@xxxxxxxxxxxxx; Pugazharasan Selvanathan - ERS, HCL Tech Subject: Re: [SI-LIST] DDR3 Signal Quality & Timing Analysis - Probe Location at DRAM - Pin or Die? Hello, the flyby CA bus on DDR3 needs careful optimization. Each DRAM is causing a little bit of reflections, and in worst case these overly on one DRAM position. What I find interesting: Often the waveshape at the die is better than at the pin ... Nevertheless here what is possible: - Optimize the loaded transmissionline part between the DRAMs. This is dependent on the distances between the DRAMs, the corresponding impedances (maybe even two different between the devices) and the input capacitance of the DRAMS. - Optimize the leadin Length of the Clock: if you have bad luck it is an reflection of the controller that hits you at the first DRAM - Optimize the length of low and high impedance routing (in the LeadIn, and maybe even between the DRAMs). - Optimize the clock termination at the end (length and value) - minimize the stub length going go each DRAM component. - Change the via arrangement for the clock The improve ment down the line is not really because the length to the termination decreases. Dependent on the Layout/design it is possible that each of the DRAMs along the bus can see the worst case of overlay of any reflections. Nevertheless often it is the first one which is getting the worst case. So I guess all I can tell is, that the design of the DDR3 Flyby bus is difficult and needs to be done very carefully. We have done some designs just by copy an existing Design to a new environment, but this is dangerous .. So best what you can do is to take your simulator and check what you can change to optimize the SI ... Best regards Hermann Our next Events: ================ Signal Ingegrity Seminar "Open the Black Box of Signal Integrity" at TH Aalen on 29th October 2011 Visit us on Embedded World 2012 Our location Hall 1 / Booth 509 Check our website or contact us for details EKH - EyeKnowHow Hermann Ruckerbauer www.EyeKnowHow.de Hermann.Ruckerbauer@xxxxxxxxxxxxx Veilchenstrasse 1 94554 Moos Tel.: +49 (0)9938 / 902 083 Mobile: +49 (0)176 / 787 787 77 Fax: +49 (0)3212 / 121 9008 schrieb Pugazharasan Selvanathan - ERS, HCL Tech: > Hello everyone, > My observations from the simulation results of a DDR3 interface (64 bit + 8 > bit ECC) with five Micron DRAMs: > > In FAST corner, when CLK is probed at PIN of first DRAM in the daisy chain, > it has good signal quality (monotonic, no DC/Vref multi-crossing). But if it > is probed at DIE of the same DRAM, CLK is non-monotonic, multi-crosses DC and > Vref thresholds. Signal Quality improves at die of the other DRAMs as we > progress down the daisy chain, since the stub length between respective DRAMs > and termination decreases. > > Give your thoughts to improve the signal quality at first DRAM's die. > Currently, the output impedance of DDR3 Controller is set to 40ohms, which is > the maximum O/P impedance it supports. > > Thanks, > Pugazharasan Selvanathan > Member Technical Staff - Design Centric Services > HCL Technologies Ltd. > #94, South Phase, Ambatur Industrial Estate, Chennai-600058 > Tel: +91-44-66892000 Extn: (2695) > www.hcl.com<http://www.hcl.com/> > > > ________________________________ > ::DISCLAIMER:: > ----------------------------------------------------------------------------------------------------------------------- > > The contents of this e-mail and any attachment(s) are confidential and > intended for the named recipient(s) only. > It shall not attach any liability on the originator or HCL or its affiliates. > Any views or opinions presented in > this email are solely those of the author and may not necessarily reflect the > opinions of HCL or its affiliates. > Any form of reproduction, dissemination, copying, disclosure, modification, > distribution and / or publication of > this message without the prior written consent of the author of this e-mail > is strictly prohibited. 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