[SI-LIST] Re: Board via characteristics (fwd)
- From: Ray Anderson <Raymond.Anderson@xxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Thu, 9 May 2002 13:49:35 -0700 (PDT)
A number of vendors market a beast known as
a 2.5D field solver. This is a 2D solver
with the capability thrown in to "model"
'selected' 3D structures such as vias and
coaxial structures.
Typically the modeling for these 3D structures
isn't done by way of field solving, but by
way of embedded closed form equations/approximations.
So when you perform the model synthesis with
a 2.5D 'solver', you actually do a solution
to a fields problem for the 2D structures, but
when you run it on a via, you actually just
do an equation based approximation. Most 2.5D
solvers that I've seen that implement the modeling
of vias output a lumped 'pi' model (C-L-C) of
the via discontinuity.
If any vendors of 2.5D solvers would like to
through in their 2 cents worth on the topic
I'd like to hear/read their comments.
Ray Anderson
Sun Microsystems Inc.
>
>
>I have heard this claim before but not bothered to check it out. Why? From
>a conceptual or theoretical perspective it seemed inappropriate. Don't most
>2D Field Solvers assume they are given the 2D cross-section of a structure
>which is long with respect to the analysis frequency? How do you take an
>appropriate 2D cross-section of a via? Seems to me a via is very much a 3D
>structure. But I've been wrong before. :-)
>
>Aubrey Sparkman
>Signal Integrity
>Aubrey_Sparkman@xxxxxxxx
>(512) 723-3592
>
>
>> -----Original Message-----
>> From: David Hoover [mailto:dhoovy@xxxxxxxxxxxxx]
>> Sent: Thursday, May 09, 2002 2:50 PM
>> To: si-list@xxxxxxxxxxxxx
>> Subject: [SI-LIST] Board via characteristics (fwd)
>>
>>
>>
>>
>> Gang,
>>
>> I was asked if I could forward this
>> question to the list for input. I'm a
>> fabricator that builds high speed PCBs
>> out of many different composites. I'm
>> also very curious about modeling vias
>> because I co-chair the IPC committee
>> on Controlled Impedance Circuit Boards and
>> High Speed Logic Design and during the last couple of
>> Conference Meetings this topic has
>> came up. I run a 2D Field Solver which I
>> believe can model for vias. Just never have
>> done it.
>>
>> Any and all response would be greatly
>> appreciated.
>>
>> David Hoover
>> Field Application Engineer
>> Data Circuit Systems, Inc.
>> (408) 280-0422 X233
>> http://www.datacircuits.com
>
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