[ibis-interconn] [Die Supply Pads]

  • From: Walter Katz <wkatz@xxxxxxxxxx>
  • To: "'IBIS-Interconnect'" <ibis-interconn@xxxxxxxxxxxxx>
  • Date: Mon, 4 Jan 2016 16:03:03 -0500 (EST)

All,



I am enclosing a presentation that cleans up the definition of [Die Supply
Pads], defines clear rules on the usage of signal_name and bus_labels, and
outlines a simple implementation of these rules.



I expect that one can create absurd cases which will fail these rules and
pass the existing IBIS parser, but I consider these examples to truly be
absurd, and something that I think all of the EDA companies will not want
to support.



I have requested that Bob represent the following simple example using
[Pin Pad Map]:



A component has 100 VDD pins (P1, P2, .P100) and all of these VDD pins
have the same bus_label (VDD).

The component has 5 VDD die pads (D1, D2, D3, D4, D5), and all of these
VDD die pads have the same bus_label.



Walter



Walter Katz

<mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx

Phone 303.449-2308

Mobile 303.335-6156

Attachment: [Die Supply Pads].pptx
Description: MS-Powerpoint 2007 presentation

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