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IBIS INTERCONNECT TASK GROUP
http://www.eda.org/ibis/interconnect_wip/
Mailing list:
ibis-interconnect@xxxxxxxxxxxxx<mailto:ibis-interconnect@xxxxxxxxxxxxx>
Archives at //www.freelists.org/archive/ibis-interconn/
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Wednesday, January 6, 2016
8 AM US Pacific Time
Objective: produce a unified package improvement proposal (BIRD) for
consideration by the IBIS Open Forum that satisfies industry package and on-die
interconnect modeling requirements
Agenda
Review of Attendees
Call for Patents
Review of Previous Meeting Minutes: Dec. 16, 2015
Opens
New Interconnect Draft BIRD Drawings
Review of Proposal Draft 28
Continue discussion of Bus Labels vs. Die Pad Names
