[SI-LIST] Re: Bond Wire Length
- From: Neeraj Pendse <cnepsc@xxxxxxxxxxxxxxx>
- To: NS121846@xxxxxxxxxxxxxxxxxxxxxxxxxxx
- Date: Fri, 17 Aug 2001 13:13:57 -0700
Norm,
I want to say the wire lengths going to signal balls should be about 4.5
(+1/-2) mm. I could give you some ball-park numbers if you answer the follwing
qustions:
1. By MBGA you mean molded BGA, right?
2. What's the body size of the BGA and the die size?
It would also help if you can give me the following information
1. Do you know if there are any power planes/and power rings?
Regards,
- Neeraj.
National Semiconductor Corporation
2900 Semiconductor Drive, Mail Stop 19-100
Santa Clara, California 95051.
http://www.national.com/, NYSE: NSM
"Smith, Norm W" wrote:
> We're using a 560pin MBGA, 1mm pitch. Anyone have any idea on the bond wire
> length? A reasonable guess would suffice. Unfortunately, our overseas ASIC
> vendor has been slow to answer this for us.
>
> Norm Smith
> NCR San Diego
>
>
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