[PCB_FORUM] Re: copper filling of micro vias.
- From: "Peter Pietrangelo" <peter_pietrangelo@xxxxxxxxxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Thu, 29 May 2008 06:46:32 -0700
Oscar, contact me at peter95123@xxxxxxxxxxxxx, I can give you contact info
for the shop we use to do HDI designs.
Peter
_____
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs
Sent: Tuesday, May 27, 2008 6:24 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: copper filling of micro vias.
I have 2 shops telling me that they can't do it. They can fill the inner
blind via and the core, but not the L1-L2 via.
I'm using a construction 2+8+2 construction w/ stack vias and a core from
L2-L7.
Can anyone recommend a good fab for HDI designs?
Thanks,
-oscar
On Mon, May 19, 2008 at 3:25 PM, Douglas Stanley <dstanley@xxxxxxxxxxxx>
wrote:
We use a 5 mil drill and a 10 mil pad on both inner and outer layers.
_____
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs
Sent: Monday, May 19, 2008 3:21 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: copper filling of micro vias.
What is your minimum drill size? We are using 12pad 5drill from L1-L2,
L2-L3.
Regards,
-oscar
On 5/19/08, Douglas Stanley <dstanley@xxxxxxxxxxxx> wrote:
We do boards every day that are 3 and 3 with microvias in pad. The board
shops completely fill the hole with copper and then plate over it. They then
planerize the copper so the pad is flat. I think it's pretty standard
nowadays. We simply add a note to the fab drawing to plate the microvia
closed and to "repad" so the surface is flat.
Douglas G. Stanley
PC Board Designer, Sr. Staff
Broadcom Corporation- Irvine, CA
dstanley@xxxxxxxxxxxx
(949) 926-5889
_____
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs
Sent: Monday, May 19, 2008 9:58 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] copper filling of micro vias.
Hi All,
Does anyone know the requirements to copper fill or epoxy fill a microvia?
microvia is via in pad. Is there an alternative?
I have a design that requires a fanout of 3.5 mil trace and 3mil airgap out
of a finepitch bga.
-oscar
____________________________________________________
oscar miguelino | lead pcb engineer | OQO, inc.
583 shotwell street | san francisco, ca 94110
(this message constitutes confidential information proprietary to OQO, Inc.)
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