[PCB_FORUM] Re: copper filling of micro vias.

Oscar, contact me at peter95123@xxxxxxxxxxxxx, I can give you contact info
for the shop we use to do HDI designs.

 

Peter

 

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From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs
Sent: Tuesday, May 27, 2008 6:24 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: copper filling of micro vias.

 

I have 2 shops telling me that they can't do it.  They can fill the inner
blind via and the core, but not the L1-L2 via.

I'm using a construction 2+8+2 construction w/ stack vias and a core from 
L2-L7.

Can anyone recommend a good fab for HDI designs?

Thanks,

-oscar

On Mon, May 19, 2008 at 3:25 PM, Douglas Stanley <dstanley@xxxxxxxxxxxx>
wrote:

We use a 5 mil drill and a 10 mil pad on both inner and outer layers.

 

 

  _____  

From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs

Sent: Monday, May 19, 2008 3:21 PM


To: icu-pcb-forum@xxxxxxxxxxxxx

Subject: [PCB_FORUM] Re: copper filling of micro vias.

What is your minimum drill size?  We are using 12pad 5drill from L1-L2,
L2-L3.

Regards,

-oscar

On 5/19/08, Douglas Stanley <dstanley@xxxxxxxxxxxx> wrote: 

We do boards every day that are 3 and 3 with microvias in pad. The board
shops completely fill the hole with copper and then plate over it. They then
planerize the copper so the pad is flat. I think it's pretty standard
nowadays. We simply add a note to the fab drawing to plate the microvia
closed and to "repad" so the surface is flat.

 

 

Douglas G. Stanley

PC Board Designer, Sr. Staff

Broadcom Corporation- Irvine, CA

dstanley@xxxxxxxxxxxx

(949) 926-5889

 

 

  _____  

From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs
Sent: Monday, May 19, 2008 9:58 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] copper filling of micro vias.

Hi All,

Does anyone know the requirements to copper fill or epoxy fill a microvia?
microvia is via in pad.  Is there an alternative?  

I have a design that requires a fanout of 3.5 mil trace and 3mil airgap out
of a finepitch bga.

-oscar

____________________________________________________

oscar miguelino | lead pcb engineer | OQO, inc.

583 shotwell street | san francisco, ca 94110

 

(this message constitutes confidential information proprietary to OQO, Inc.)

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