[PCB_FORUM] Re: copper filling of micro vias.
- From: "malou teoxon" <malou.teoxon@xxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Thu, 22 May 2008 15:37:00 +0800
Hi Oscar
Base on my previous design with a fine pitch csp package
We design
with via on pad : drill size is 3 mils
Dimple requirement for the via on pad is >20 um
On 5/20/08, O Migs <o.miguelino@xxxxxxxxx> wrote:
>
> Hi All,
>
> Does anyone know the requirements to copper fill or epoxy fill a microvia?
> microvia is via in pad. Is there an alternative?
>
> I have a design that requires a fanout of 3.5 mil trace and 3mil airgap out
> of a finepitch bga.
>
> -oscar
>
> ____________________________________________________
> oscar miguelino | lead pcb engineer | *OQO*, inc.
> 583 shotwell street | san francisco, ca 94110
>
> *(this message constitutes confidential information proprietary to OQO,
> Inc.)*
>
>
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