[PCB_FORUM] Re: copper filling of micro vias.

Hi Oscar

Base on my previous design with a fine pitch csp package
We design
with via on pad : drill size is 3 mils
Dimple requirement for the via on pad is >20 um




On 5/20/08, O Migs <o.miguelino@xxxxxxxxx> wrote:
>
> Hi All,
>
> Does anyone know the requirements to copper fill or epoxy fill a microvia?
> microvia is via in pad.  Is there an alternative?
>
> I have a design that requires a fanout of 3.5 mil trace and 3mil airgap out
> of a finepitch bga.
>
> -oscar
>
> ____________________________________________________
> oscar miguelino | lead pcb engineer | *OQO*, inc.
> 583 shotwell street | san francisco, ca 94110
>
> *(this message constitutes confidential information proprietary to OQO,
> Inc.)*
>
>

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