[PCB_FORUM] Re: copper filling of micro vias.
- From: "Deac Descoteaux" <deac007@xxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Thu, 29 May 2008 09:42:36 -0400
Hello Oscar,
Sure, please reply to this email.
Deac
On Tue, May 27, 2008 at 9:23 PM, O Migs <o.miguelino@xxxxxxxxx> wrote:
> I have 2 shops telling me that they can't do it. They can fill the inner
> blind via and the core, but not the L1-L2 via.
>
> I'm using a construction 2+8+2 construction w/ stack vias and a core from
> L2-L7.
>
> Can anyone recommend a good fab for HDI designs?
>
> Thanks,
>
> -oscar
>
>
> On Mon, May 19, 2008 at 3:25 PM, Douglas Stanley <dstanley@xxxxxxxxxxxx>
> wrote:
>
>> We use a 5 mil drill and a 10 mil pad on both inner and outer layers.
>>
>>
>> ------------------------------
>> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
>> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *O Migs
>> *Sent:* Monday, May 19, 2008 3:21 PM
>> *To:* icu-pcb-forum@xxxxxxxxxxxxx
>> *Subject:* [PCB_FORUM] Re: copper filling of micro vias.
>>
>> What is your minimum drill size? We are using 12pad 5drill from L1-L2,
>> L2-L3.
>>
>> Regards,
>>
>> -oscar
>>
>> On 5/19/08, Douglas Stanley <dstanley@xxxxxxxxxxxx> wrote:
>>>
>>> We do boards every day that are 3 and 3 with microvias in pad. The
>>> board shops completely fill the hole with copper and then plate over it.
>>> They then planerize the copper so the pad is flat. I think it's pretty
>>> standard nowadays. We simply add a note to the fab drawing to plate the
>>> microvia closed and to "repad" so the surface is flat.
>>>
>>>
>>> Douglas G. Stanley
>>> PC Board Designer, Sr. Staff
>>> Broadcom Corporation- Irvine, CA
>>> dstanley@xxxxxxxxxxxx
>>> (949) 926-5889
>>>
>>>
>>> ------------------------------
>>> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
>>> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *O Migs
>>> *Sent:* Monday, May 19, 2008 9:58 AM
>>> *To:* icu-pcb-forum@xxxxxxxxxxxxx
>>> *Subject:* [PCB_FORUM] copper filling of micro vias.
>>>
>>> Hi All,
>>>
>>> Does anyone know the requirements to copper fill or epoxy fill a
>>> microvia? microvia is via in pad. Is there an alternative?
>>>
>>> I have a design that requires a fanout of 3.5 mil trace and 3mil airgap
>>> out of a finepitch bga.
>>>
>>> -oscar
>>>
>>> ____________________________________________________
>>> oscar miguelino | lead pcb engineer | *OQO*, inc.
>>> 583 shotwell street | san francisco, ca 94110
>>>
>>> *(this message constitutes confidential information proprietary to OQO,
>>> Inc.)*
>>>
>>>
>>
>
--
Deac Descoteaux
8 Wayne Drive
Nashua, NH 03062
Cell: (603) 557-7568
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