[SI-LIST] substrate can be used more than 40 GHz

  • From: "William M. Balliette/AT-Austin/3M/US" <wmballiette@xxxxxxx>
  • To: si-list@xxxxxxxxxxxxx
  • Date: Fri, 6 Dec 2002 15:50:04 -0600

$)CLCP films have low permeability and loss tangent around .003, and can be
processed into 1 metal layer and 2 metal layer substrates. Dielectric
thicknesses are typically 25 and 50 micron, but can be thinned down below
15 microns.

I can provide more information upon request.

Thanks,
Bill Balliette
wmballiette@xxxxxxx


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Hi Experts!

I am looking for the substrate can be used more than 40 GHz with low
relative permeability and loss tangent.
I would like to design grounded CPW with the substrate.
The substrate thickness is considered to be as small as order of tens of
micrometer.

So far, I have used alumina, but it's relative permeability is so large
that cavity resonance often occurred in my design.

Hope to get a good news from you...

Regards,

Kwang-Seong Choi

_________________________________________________________________
55C3?! 55;g8.4B @gGX@G @'Gh5i. AIG@G 9+7a:8Gh@87N GX0aGO<<?d.
http://www.msn.co.kr/webinclude/exredir.asp?STARTID=CLIP_5644&adgroup=KRMGEN&URL=http://msn.aigis.co.kr/weekly_msn/main.asp



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