Can anyone help me understand the source of the pcb routing recommendations I see for DDR4. For instance DQ to DQS timing for a byte lane? I see some papers quoting 90ps or 50mil, but I don't know where those numbers come from. At a basic level I understand that DQS is the clock for the data byte on DQ, And that the total timing budget must be spread across chip, package, board, and dram. If I look at say DDR4-2800 that's a clock of 1.4Ghz with a period of 714ps. So at double data rate I figure each byte is 357ps wide. Then that should mean I have +/- 178ps of total margin that the DQS can move from it's ideal position of being in the center of the. I think :) Maybe that's where the 90ps for the board and 90ps for chip come from. Anyway I'm just having trouble finding a good explanation to help me understand how all that timing margin is calculated for each piece in the chain. I did try to look up DQ-DQS timing in the JEDEC standard and it just says TBD. I've found several docs that give me an idea of what values to use, but none so far that explain how they are calculated. I feel like this is still an SI related question since I'll use this information to setup constraints for my simulations but sorry if it's off topic. Thank you. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List forum is accessible at: http://tech.groups.yahoo.com/group/si-list List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu