[SI-LIST] Re: package models
- From: "Tsuk, Michael" <Michael.Tsuk@xxxxxxxxxx>
- To: <cmoll@xxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Tue, 5 Feb 2002 09:54:21 -0500
Carlos Moll asked:
> So, the question would be what would be the preferred format for
> supporting the more advanced, coupling based package models?
We've gotten good results with lumped coupled SPICE models for our =
latest Alpha packages, as we reported at EPEP'01. In theory, =
transmission line models would be better, but they would have to be =
fully coupled, lossy, non-uniform transmission line models, and I'm not =
aware of any simulators that have such models included.
--=20
Michael Tsuk
Compaq AlphaServer Platform Group
(508) 467-4621
-----Original Message-----
From: Carlos Moll [mailto:cmoll@xxxxxxxxxxx]
Sent: Friday, February 01, 2002 11:11 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] package models
There is noticeable changes in today's requirements for package modeling =
=3D
and the distribution formats of such models. To keep it simply, =3D
lumped, narrow bandwidth, uncoupled package models are no longer =3D
supporting the level of accuracy needed for dealing with high speed =3D
design issues. Additionally, an end goal would be to support concurrent =
=3D
Chip-Package-PCB design.
There are various model types available (just looking for format info at =
=3D
this point, which would be irrelevant on the solvers used and whether =
=3D
flipchip or wirebond technology)
Some examples;
Lumped, uncoupled
Lumped, Coupled
Distributed t-line=3D20
PEEC Based....
with a wide range of formats (ebd, dml, spice, s-param, etc..) which =3D
could be used either in the time domain or frequency domain or =
both....=3D20
So, the question would be what would be the preferred format for =3D
supporting the more advanced, coupling based package models?
Thank you for the input.
Carlos Moll
Cadence Design Systems, Inc.
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