There is noticeable changes in today's requirements for package modeling = and the distribution formats of such models. To keep it simply, = lumped, narrow bandwidth, uncoupled package models are no longer = supporting the level of accuracy needed for dealing with high speed = design issues. Additionally, an end goal would be to support concurrent = Chip-Package-PCB design. There are various model types available (just looking for format info at = this point, which would be irrelevant on the solvers used and whether = flipchip or wirebond technology) Some examples; Lumped, uncoupled Lumped, Coupled Distributed t-line=20 PEEC Based.... with a wide range of formats (ebd, dml, spice, s-param, etc..) which = could be used either in the time domain or frequency domain or both....=20 So, the question would be what would be the preferred format for = supporting the more advanced, coupling based package models? Thank you for the input. Carlos Moll Cadence Design Systems, Inc. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu