[SI-LIST] package models

  • From: "Carlos Moll" <cmoll@xxxxxxxxxxx>
  • To: <si-list@xxxxxxxxxxxxx>
  • Date: Fri, 1 Feb 2002 08:10:32 -0800

There is noticeable changes in today's requirements for package modeling =
and the distribution formats of such models.   To keep it simply, =
lumped, narrow bandwidth, uncoupled package models are no longer =
supporting the level of accuracy needed for dealing with high speed =
design issues.  Additionally, an end goal would be to support concurrent =
Chip-Package-PCB design.

There are various model types available (just looking for format info at =
this point, which would be irrelevant on the solvers used and whether =
flipchip or wirebond technology)

Some examples;
Lumped, uncoupled
Lumped, Coupled
Distributed t-line=20
PEEC Based....
with a wide range of formats (ebd, dml, spice, s-param, etc..) which =
could be used either in the time domain or frequency domain or both....=20

So, the question would be what would be the preferred format for =
supporting the more advanced, coupling based package models?

Thank you for the input.

Carlos Moll
Cadence Design Systems, Inc.
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