I am interested in variations in the Thermal conductivity coefficients
(in-plane and through-plane) of various glass/resin ratios, also.
The industry needs additional research in all these properties of
dielectric materials.
Doug Brooks
********************************************
(See Doug's new book, "PCB Trace and Via Currents and Temperatures; The
Complete, Analysis" available on Amazon.)
Richard Allred wrote:
Greetings,
I am aware that typical PCB manufacturers usually guarantee some impedance
target (+/- 10 or 15%) for high speed traces and that they may use any
number of manufacturing controls to achieve this. The result is that the
only way to know the geometric dimensions of a given sample is to
cross-section it.
What I am interested in is, what kind of variation can be expected in the
effective dielectric properties due to the PCB manufacturers tweaking of
the glass/resin ratio and the geometrical variation? Is anyone aware of a
published study that reports this?
Kind regards,
Richard Allred
www.SiSoft.com
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