[SI-LIST] Thermal reliefs
- From: MJA <mja.lists@xxxxxxxxx>
- To: SI List <si-list@xxxxxxxxxxxxx>
- Date: Thu, 20 Jan 2005 10:18:44 -0500
Hello,
I have a few questions regarding thermal reliefs on vias and through holes.
Is thermal reliefs on through holes a standard practice? Generally
what percentage of total periphery of the via/hole remains in contact
with the plane?
Is there any adverse effects from having thermal reliefs on a through
hole connector pins?
For standard through hole connectors like DIMM connectors, can I
assume that the number of power and GND pins are determined after
considering the effect of thermal relief on conducting area?
Thanking you all in advance,
MJA
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