[SI-LIST] PCB Thermal Analysis
- From: "Ramkrishna Reddy" <rkreddy@xxxxxxxxxxxxxxxx>
- To: <mja.lists@xxxxxxxxx>, "SI List" <si-list@xxxxxxxxxxxxx>
- Date: Fri, 21 Jan 2005 09:39:58 +0530
Hi all,
Can somebody explain me, what are the input parameters are required for
doing thermal analysis of Mil grade PCB.
Thanks
R K R
----- Original Message -----
From: "MJA" <mja.lists@xxxxxxxxx>
To: "SI List" <si-list@xxxxxxxxxxxxx>
Sent: Thursday, January 20, 2005 8:48 PM
Subject: [SI-LIST] Thermal reliefs
> Hello,
> I have a few questions regarding thermal reliefs on vias and through
holes.
>
> Is thermal reliefs on through holes a standard practice? Generally
> what percentage of total periphery of the via/hole remains in contact
> with the plane?
>
> Is there any adverse effects from having thermal reliefs on a through
> hole connector pins?
>
> For standard through hole connectors like DIMM connectors, can I
> assume that the number of power and GND pins are determined after
> considering the effect of thermal relief on conducting area?
>
> Thanking you all in advance,
>
> MJA
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