Hi David,
If you want to reduce the pad capacitance and thus to eliminate the
impedance step
in connection point of the trace and the footprint pad, then yes, you
can remove the ground plane
under the signal pad.
Actually it's possible to make a small 3D EM simulation to check the
impedance discontinuity in both cases,
with and without the ground metal under the pad.
Best wishes,
Alexander Akulin
17.06.2016 5:12, David Banas пишет:
Hi all,
Would anyone care to offer an opinion on whether or not it�s a good idea to
excavate the ground plane metal beneath the pin lands of a Samtec QSH series
connector, when designing the footprint?
The example footprints on Samtec�s web site do NOT have this metal excavated,
but I�ve heard rumors that their SI team recommends this practice to those,
whom inquire. I�m just looking for some clarity and clarification on the
subject.
Thanks!
-db
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