dave
For modern thin dielectric boards, it always helps. If your signals are
differential, then I place an opening that covers the entire area of two
pads. Without EM analysis, this is free margin. With EM analysis you can
tweak a bit more performance out.
Scott
Scott McMorrow
R&D Consultant
Teraspeed Consulting - A Division of Samtec
16 Stormy Brook Rd
Falmouth, ME 04105
(401) 284-1827 Business
http://www.teraspeed.com
On Fri, Jun 17, 2016 at 2:50 AM, Alexander Akulin (PCBtech) <
akulin@xxxxxxxxxx> wrote:
Hi David,
If you want to reduce the pad capacitance and thus to eliminate the
impedance step
in connection point of the trace and the footprint pad, then yes, you
can remove the ground plane
under the signal pad.
Actually it's possible to make a small 3D EM simulation to check the
impedance discontinuity in both cases,
with and without the ground metal under the pad.
Best wishes,
Alexander Akulin
17.06.2016 5:12, David Banas пиÑеÑ:
Hi all,to excavate the ground plane metal beneath the pin lands of a Samtec QSH
Would anyone care to offer an opinion on whether or not it�s a good idea
series connector, when designing the footprint?
excavated, but I�ve heard rumors that their SI team recommends this
The example footprints on Samtec�s web site do NOT have this metal
practice to those, whom inquire. I�m just looking for some clarity and
clarification on the subject.
Thanks!
-db
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