To All- Thanks to all who have posted. A little more background on the board (if interested): -Trace Thickness: Microstrip=3D16mil; Stripline=3D8mil (before fab - trace loses about 0.5mil on each side through manufacturing process) -Board Thickness ~200mil. -Layer Thickness =3D 8mil -Hard-gold electrolytic plating of 15-50mils thickness The launch structures, and a small portion of the trace was modeled in HFSS. I added a 0.3mil layer of soldermask (used FR4 material) to model. From all of your responses, it appears the most important parameters that i have not included in my models are surface roughness and frequency-dependent dielectric. HFSS can account for both of them. I will put those into the model and see if it helps. ED - I am not familiar with correlating sick and surface roughness. How can i correlate these values to the capacitance? Thank you very much for the replies. Any more thoughts will certainly be appreciated. If anybody is interested in working with some of the data, feel free to email me at ryan.satrom@xxxxxxxxxxxx Thanks again. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu