[SI-LIST] Re: R: Re: Wire bonding
- From: steve weir <weirsi@xxxxxxxxxx>
- To: "Xilei Liu" <xileil@xxxxxxxxxxx>,gianguida@xxxxxxxx, steven.salkow@xxxxxxxx,si-list@xxxxxxxxxxxxx
- Date: Wed, 09 Aug 2006 01:15:14 -0700
Celine, it depends on how well the spacing is controlled to nearby
metal. The joint itself is not generally a tolerance problem.
Steve.
At 01:09 AM 8/9/2006, Xilei Liu wrote:
>How accurate can these models be for a bond wire with its
>unpredictable soldering conditions or other joint condictions in the
>real world?
>
>Regards,
>Celine
>
>
>>From: <gianguida@xxxxxxxx>
>>Reply-To: gianguida@xxxxxxxx
>>To: <steven.salkow@xxxxxxxx>,<weirsi@xxxxxxxxxx>,<si-list@xxxxxxxxxxxxx>
>>CC: <dburns@xxxxxxxxxx>
>>Subject: [SI-LIST] R: Re: Wire bonding
>>Date: Tue, 8 Aug 2006 18:09:55 +0200
>>
>>dear Steven,
>>I would disagree with you
>>up to date 3D simulator does not require several days just to setup a model
>>in addition if you can get a good support and a training
>>I am quite sure it is possible to setup several model in one day :-)))
>>
>>Respectfully
>>Giancarlo
>>-----Messaggio originale-----
>>Da: si-list-bounce@xxxxxxxxxxxxx per conto di Salkow, Steven
>>Inviato: mar 08/08/2006 17.35
>>A: weirsi@xxxxxxxxxx; si-list@xxxxxxxxxxxxx
>>Cc: dburns@xxxxxxxxxx
>>Oggetto: [SI-LIST] Re: Wire bonding
>>
>>David:
>>3D field solvers are very hard to use and require several days to even
>>set up a simulation. There are people that are experts at this and
>>affordably charge by the hour.
>>Here's a contact
>>Douglas Burns ,Vice President, Consulting Services/Chief Consultant
>>,Signal Integrity Software, Inc. ,6 Clock Tower Place ,Maynard, MA 01754
>>,978-461-0449 x14 ,dburns@xxxxxxxxxx , CCA pcb design
>>
>>By the way, 3D field solvers are very expensive and have a steep
>>learning curve.
>>
>>Another approach is to find someone using the same package you are using
>>that has an IBIS model for it. The pin parasitics should be in the ASCII
>>file. (many IBIS files are available for download)
>>
>>Steven Salkow
>>Senior Staff
>>Lockheed IS&S
>>3130 Zanker Rd, San Jose
>>Ca. 94588
>>(408) 473-4058
>>
>>steven.salkow@xxxxxxxx
>>salkow@xxxxxxxxxxxx
>>
>>
>>
>>
>>
>>-----Original Message-----
>>From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
>>On Behalf Of steve weir
>>Sent: Monday, August 07, 2006 8:24 PM
>>To: dan1_st@xxxxxxxxx; si-list@xxxxxxxxxxxxx
>>Subject: [SI-LIST] Re: Wire bonding
>>
>>David, unless you have considerable experience with structures that
>>have very similar geometry you can not estimate reliably accurate
>>numbers. 5Gb is fast enough that you have the potential to excite
>>some less than amusing resonances that can keep you from transferring
>>much energy between your sources and intended loads. Your packaging
>>house may be able to help you. Otherwise you need to find 3D field
>>solver software and someone who knows how to drive it.
>>
>>Steve.
>>At 02:22 PM 8/7/2006, david stern wrote:
>> >HI
>> >
>> >We are designing an electro-optical element for
>> >infiniband optical transceiver.
>> >We are using a driver as a dye chip with wire bonding
>> >process.
>> >The 1 mil wire is 1mm long. One side of the dye chip
>> >is using 2 wires for differential input
>> >and on the other side we use 1 wire surrounded with 2
>> >GND wires for signal.
>> >Our devices are design to work at baud rate of 5Gbps.
>> >
>> >I tried to get information on the web about signal
>> >integrity for high speed wire bond without any
>> >success.
>> >
>> > 1. Where can I find material about SI for wire
>> >bonding?
>> >2. how shall I define wire bond in simulation? shall
>> >I defied it as inductor?
>> >3. How shall I calculate the impedance of the wire
>> >bonding?
>> >4. Are there cases were wire bond can be neglect due
>> >to the fact that it place right after the driver or
>> > right before the receiver?
>> >
>> >
>> >Thanks in advance
>> >David
>> >
>> >
>> >
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