[SI-LIST] R: Re: Wire bonding
- From: <gianguida@xxxxxxxx>
- To: <steven.salkow@xxxxxxxx>, <weirsi@xxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Tue, 8 Aug 2006 18:09:55 +0200
dear Steven,
I would disagree with you
up to date 3D simulator does not require several days just to setup a model
in addition if you can get a good support and a training
I am quite sure it is possible to setup several model in one day :-)))
Respectfully
Giancarlo
-----Messaggio originale-----
Da: si-list-bounce@xxxxxxxxxxxxx per conto di Salkow, Steven
Inviato: mar 08/08/2006 17.35
A: weirsi@xxxxxxxxxx; si-list@xxxxxxxxxxxxx
Cc: dburns@xxxxxxxxxx
Oggetto: [SI-LIST] Re: Wire bonding
David:
3D field solvers are very hard to use and require several days to even
set up a simulation. There are people that are experts at this and
affordably charge by the hour.
Here's a contact
Douglas Burns ,Vice President, Consulting Services/Chief Consultant
,Signal Integrity Software, Inc. ,6 Clock Tower Place ,Maynard, MA 01754
,978-461-0449 x14 ,dburns@xxxxxxxxxx , CCA pcb design
By the way, 3D field solvers are very expensive and have a steep
learning curve.
Another approach is to find someone using the same package you are using
that has an IBIS model for it. The pin parasitics should be in the ASCII
file. (many IBIS files are available for download)
Steven Salkow
Senior Staff
Lockheed IS&S
3130 Zanker Rd, San Jose
Ca. 94588
(408) 473-4058
steven.salkow@xxxxxxxx
salkow@xxxxxxxxxxxx
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of steve weir
Sent: Monday, August 07, 2006 8:24 PM
To: dan1_st@xxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Wire bonding
David, unless you have considerable experience with structures that
have very similar geometry you can not estimate reliably accurate
numbers. 5Gb is fast enough that you have the potential to excite
some less than amusing resonances that can keep you from transferring
much energy between your sources and intended loads. Your packaging
house may be able to help you. Otherwise you need to find 3D field
solver software and someone who knows how to drive it.
Steve.
At 02:22 PM 8/7/2006, david stern wrote:
>HI
>
>We are designing an electro-optical element for
>infiniband optical transceiver.
>We are using a driver as a dye chip with wire bonding
>process.
>The 1 mil wire is 1mm long. One side of the dye chip
>is using 2 wires for differential input
>and on the other side we use 1 wire surrounded with 2
>GND wires for signal.
>Our devices are design to work at baud rate of 5Gbps.
>
>I tried to get information on the web about signal
>integrity for high speed wire bond without any
>success.
>
> 1. Where can I find material about SI for wire
>bonding?
>2. how shall I define wire bond in simulation? shall
>I defied it as inductor?
>3. How shall I calculate the impedance of the wire
>bonding?
>4. Are there cases were wire bond can be neglect due
>to the fact that it place right after the driver or
> right before the receiver?
>
>
>Thanks in advance
>David
>
>
>
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