[SI-LIST] Re: R: Re: Wire bonding
- From: "Xilei Liu" <xileil@xxxxxxxxxxx>
- To: gianguida@xxxxxxxx, steven.salkow@xxxxxxxx, weirsi@xxxxxxxxxx, si-list@xxxxxxxxxxxxx
- Date: Wed, 09 Aug 2006 08:09:57 +0000
How accurate can these models be for a bond wire with its unpredictable
soldering conditions or other joint condictions in the real world?
Regards,
Celine
>From: <gianguida@xxxxxxxx>
>Reply-To: gianguida@xxxxxxxx
>To: <steven.salkow@xxxxxxxx>,<weirsi@xxxxxxxxxx>,<si-list@xxxxxxxxxxxxx>
>CC: <dburns@xxxxxxxxxx>
>Subject: [SI-LIST] R: Re: Wire bonding
>Date: Tue, 8 Aug 2006 18:09:55 +0200
>
>dear Steven,
>I would disagree with you
>up to date 3D simulator does not require several days just to setup a model
>in addition if you can get a good support and a training
>I am quite sure it is possible to setup several model in one day :-)))
>
>Respectfully
>Giancarlo
>-----Messaggio originale-----
>Da: si-list-bounce@xxxxxxxxxxxxx per conto di Salkow, Steven
>Inviato: mar 08/08/2006 17.35
>A: weirsi@xxxxxxxxxx; si-list@xxxxxxxxxxxxx
>Cc: dburns@xxxxxxxxxx
>Oggetto: [SI-LIST] Re: Wire bonding
>
>David:
>3D field solvers are very hard to use and require several days to even
>set up a simulation. There are people that are experts at this and
>affordably charge by the hour.
>Here's a contact
>Douglas Burns ,Vice President, Consulting Services/Chief Consultant
>,Signal Integrity Software, Inc. ,6 Clock Tower Place ,Maynard, MA 01754
>,978-461-0449 x14 ,dburns@xxxxxxxxxx , CCA pcb design
>
>By the way, 3D field solvers are very expensive and have a steep
>learning curve.
>
>Another approach is to find someone using the same package you are using
>that has an IBIS model for it. The pin parasitics should be in the ASCII
>file. (many IBIS files are available for download)
>
>Steven Salkow
>Senior Staff
>Lockheed IS&S
>3130 Zanker Rd, San Jose
>Ca. 94588
>(408) 473-4058
>
>steven.salkow@xxxxxxxx
>salkow@xxxxxxxxxxxx
>
>
>
>
>
>-----Original Message-----
>From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
>On Behalf Of steve weir
>Sent: Monday, August 07, 2006 8:24 PM
>To: dan1_st@xxxxxxxxx; si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] Re: Wire bonding
>
>David, unless you have considerable experience with structures that
>have very similar geometry you can not estimate reliably accurate
>numbers. 5Gb is fast enough that you have the potential to excite
>some less than amusing resonances that can keep you from transferring
>much energy between your sources and intended loads. Your packaging
>house may be able to help you. Otherwise you need to find 3D field
>solver software and someone who knows how to drive it.
>
>Steve.
>At 02:22 PM 8/7/2006, david stern wrote:
> >HI
> >
> >We are designing an electro-optical element for
> >infiniband optical transceiver.
> >We are using a driver as a dye chip with wire bonding
> >process.
> >The 1 mil wire is 1mm long. One side of the dye chip
> >is using 2 wires for differential input
> >and on the other side we use 1 wire surrounded with 2
> >GND wires for signal.
> >Our devices are design to work at baud rate of 5Gbps.
> >
> >I tried to get information on the web about signal
> >integrity for high speed wire bond without any
> >success.
> >
> > 1. Where can I find material about SI for wire
> >bonding?
> >2. how shall I define wire bond in simulation? shall
> >I defied it as inductor?
> >3. How shall I calculate the impedance of the wire
> >bonding?
> >4. Are there cases were wire bond can be neglect due
> >to the fact that it place right after the driver or
> > right before the receiver?
> >
> >
> >Thanks in advance
> >David
> >
> >
> >
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