[SI-LIST] Placement of power/ground balls in BGAs
- From: "Alaa Alani" <Alaa.Alani@xxxxxxxxxx>
- To: "SI LIST" <si-list@xxxxxxxxxxxxx>
- Date: Mon, 7 Jan 2008 11:57:02 -0000
=20=0D=0AHi,=0D=0A=20=0D=0AI am looking into the placement of power and gro=
und balls in BGA=0D=0Apackages. In Xilinx's Virtex-II handbook, it is shown=
that GND balls are=0D=0Aplaced in the centre island (beneath the die) and =
also arranged radially=0D=0Atowards the four corners of the package. Power =
balls on the other hand,=0D=0Aare surrounding the die on four sides. Are th=
ere any guidelines for=0D=0Aplacement of pwr/gnd balls in BGA=3F Should the=
number of power and ground=0D=0Aballs be the same or should we allocate mo=
re ground balls in order to=0D=0Areduce ground bounce=3F=0D=0A=20=0D=0AThan=
ks,=0D=0AAlaa Alani=0D=0AImagination Technologies=0D=0A=0D=0A-=0D=0AThis me=
ssage is subject to Imagination Technologies' e-mail terms: http://www.imgt=
ec.com/e-mail.htm=0D=0A-=0D=0A
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