[SI-LIST] Re: Lee Ritchey's book
- From: steve weir <weirsp@xxxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Thu, 06 Nov 2003 04:44:52 -0800
Rich,
I just read the book last night.
The good:
It lives up to being a handbook offering practical advice. It is directed
at helping the reader succeed. It could save a lot of people who might
otherwise get themselves into deep trouble.
The book does a nice job with PCB construction details, materials,
practical feature limits, and trade-offs.
Chapters 32 - 37 on power distribution issues are very good, with strong
analysis, and practical solutions.
The writing is very accessible probably even to "TTL jockeys" and
"programmers".
The book is published on heavy coated paper with plentiful, high quality
images and illustrations.
The bad:
The book begins by extolling the virtues of analysis over black art
rules. But throughout the book are various rules without the supporting
analysis, or more importantly, in some cases the limitations of a given
rule. Lee does have a reason for each of his rules, but like so many rules
out there, the justifications and limitations are not quantified.
At 288 *.5" X 11" pages of 10 point type, I've seen meatier
books. Considering the difficulty that many people would have at obtaining
some of the very useful information in it, $125. at the end of the day it
is probably still well worth it for many people working on high speed
boards, and probably a lot of people who don't realize that they are due to
current edge rates. And no, that's not just a "Rambo Rich Body Boy" talking.
However, in it's current state, I wouldn't put this on a must-have list
like Dr. Johnson's famous "Black Magic" book.
Some of the information in the power chapters by John Zasio appears to
contradict Lee in earlier chapters. That should be resolved.
Like any first edition, I think it has a few errors. I'll take what I
think those are up with Lee and see if he can convince me otherwise.
Overall
A lot of expertise went into Lee's book, and clearly so did a lot of effort
to make the material not just presentable, but flow. That's not an easy
thing to do.
My feeling here is that the book in content is a lot like the notes one
would get from a good two or three day seminar, ( and that sort of
privilege tends to cost $1000. or more ), but printed on very nice paper
with very good photographic plates. If I were Lee's editor, I would recommend:
These are all JMO.
Elimination of generalizations.
Expansion on certain topics.
Inclusion of two topics left to "Volume 2"
Addition of one or two chapters that tie the whole thing together.
Resolution of controversial or potentially incorrect assertions.
All JMO.
Regards,
"Rambo Rich Body Boy", Steve
At 06:55 AM 11/6/2003 -0500, Rich Peyton wrote:
>Sounds like a very interesting book! Does anyone, who has it, have any
>comments on how the subjects are presented within the book?
>
>No more comments about the price--please.
>
>Rich
>
>-----Original Message-----
>From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
>Behalf Of steve weir
>Sent: Wednesday, November 05, 2003 7:38 PM
>To: si-list@xxxxxxxxxxxxx
>Subject: [SI-LIST] Lee Ritchey's book
>
>
>To all those curious about Lee's new book: "Right the First Time, A
>Practical Handbook on High Speed PCB and System Design, Volume One" here
>is the table of contents:
>
>Chapter 1: Introduction
>Chapter 2: The Electrical Engineering Problem
>Chapter 3: Mjor Elements in an Electronic System
>Chapter 4: Assumptions Often Made About Electronic Systems
>Chapter 5: How Different from Ideal Real Systems and Their Components
>Are
>Chapter 6: Transmission Lines
>Chapter 7: What's Moving on a Transmission Line
>Chapter 8: Basics of Eletromagnetic Fields
>Chapter 9: Digital vs. RF/Microwve vs. Analog
>Chapter 10: Time and Distance
>Chapter 11: Inductance
>Chapter 12: Capacitance
>Chapter 13: Resistance
>Chapter 14: Fundamentals of Transmission Lines
>Chapter 15: The Concept of Ground and Power Planes
>Chapter 16: Impedance
>Chapter 17: Relfections-What Causes Them, What They Do to a Signal
>Chapter 18: What is Meant by Signal Integrity Engineering
>Chapter 19: When is a Design High Speed
>Chapter 20: Controlling Reflections by Using Terminations
>Chapter 21: Terminator Type, Terminator Placement and Net Sequencing
>Chapter 22: Stubs on Transmission Lines?
>Chapter 23: Properies of Transmission Lines that Affect Impedance
>Chapter 24: Methods for Calculating and Measuring Impedance
>Chapter 25: Right Angle Bends and Vias Potential Sources of Reflections
>and
>Other Problems
>Chapter 26: Types of Drivers or Sources
>Chapter 27: Types of Loads
>Chapter 28: Bus Protocols
>Chapter 29: Crosstalk or Coupling
>Chapter 30: Single Ended Signaling
>Chapter 31: Differential Signaling
>Chapter 32: The Power Subsystem
>Chapter 33: Power Distribution DC Drop
>Chapter 34: Decoupling Capacitors
>Chapter 35: Power Subsystem Inductance
>Chapter 36: Power Dissipation Estimate
>Chapter 37: Example Power Subsystem Design
>Chapter 38: IC Packages-Vcc and Ground Bounce or SSN
>Chapter 39: Noise Margins
>Chapter 40: Design Rule Creation Using Noise Margin Analysis
>Chapter 41: PCB Fabrication Process
>Chapter 42: PCB Materials
>Chapter 43: Crating PCB Stackups
>Chapter 44: Types of Vias
>Chapter 45: PCB Design Process
>Chapter 46: PCB Routing
>Chapter 47: Documentation
>Chapter 48: The Ideal Component Data Sheet
>Glossary
>Appendix 1: Bibliography
>Appendix 2: Anatomy of a Plated Through Hole
>Appendix 3: Selecting PCB Suppliers
>Appendix 4: A Page of Useful Equations
>Appendix 5: Technology Table Explanation
>Appendix 6: Drill Table
>Appendix 7: Conversion Tables
>
>Regards,
>
>
>Steve.
>
>
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