[SI-LIST] Lee Ritchey's book

  • From: steve weir <weirsp@xxxxxxxxxx>
  • To: si-list@xxxxxxxxxxxxx
  • Date: Wed, 05 Nov 2003 16:37:34 -0800

To all those curious about Lee's new book:  "Right the First Time, A 
Practical Handbook on High Speed PCB and System Design, Volume One"  here 
is the table of contents:

Chapter 1:      Introduction
Chapter 2:      The Electrical Engineering Problem
Chapter 3:      Mjor Elements in an Electronic System
Chapter 4:      Assumptions Often Made About Electronic Systems
Chapter 5:      How Different from Ideal Real Systems and Their Components Are
Chapter 6:      Transmission Lines
Chapter 7:      What's Moving on a Transmission Line
Chapter 8:      Basics of Eletromagnetic Fields
Chapter 9:      Digital vs. RF/Microwve vs. Analog
Chapter 10:     Time and Distance
Chapter 11:     Inductance
Chapter 12:     Capacitance
Chapter 13:     Resistance
Chapter 14:     Fundamentals of Transmission Lines
Chapter 15:     The Concept of Ground and Power Planes
Chapter 16:     Impedance
Chapter 17:     Relfections-What Causes Them, What They Do to a Signal
Chapter 18:     What is Meant by Signal Integrity Engineering
Chapter 19:     When is a Design High Speed
Chapter 20:     Controlling Reflections by Using Terminations
Chapter 21:     Terminator Type, Terminator Placement and Net Sequencing
Chapter 22:     Stubs on Transmission Lines?
Chapter 23:     Properies of Transmission Lines that Affect Impedance
Chapter 24:     Methods for Calculating and Measuring Impedance
Chapter 25:     Right Angle Bends and Vias Potential Sources of Reflections and 
Other Problems
Chapter 26:     Types of Drivers or Sources
Chapter 27:     Types of Loads
Chapter 28:     Bus Protocols
Chapter 29:     Crosstalk or Coupling
Chapter 30:     Single Ended Signaling
Chapter 31:     Differential Signaling
Chapter 32:     The Power Subsystem
Chapter 33:     Power Distribution DC Drop
Chapter 34:     Decoupling Capacitors
Chapter 35:     Power Subsystem Inductance
Chapter 36:     Power Dissipation Estimate
Chapter 37:     Example Power Subsystem Design
Chapter 38:     IC Packages-Vcc and Ground Bounce or SSN
Chapter 39:     Noise Margins
Chapter 40:     Design Rule Creation Using Noise Margin Analysis
Chapter 41:     PCB Fabrication Process
Chapter 42:     PCB Materials
Chapter 43:     Crating PCB Stackups
Chapter 44:     Types of Vias
Chapter 45:     PCB Design Process
Chapter 46:     PCB Routing
Chapter 47:     Documentation
Chapter 48:     The Ideal Component Data Sheet
Glossary
Appendix        1:      Bibliography
Appendix        2:      Anatomy of a Plated Through Hole
Appendix        3:      Selecting PCB Suppliers
Appendix        4:      A Page of Useful Equations
Appendix        5:      Technology Table Explanation
Appendix        6:      Drill Table
Appendix        7:      Conversion Tables

Regards,


Steve.


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